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bonded-pair Datasheet PDF File

For bonded-pair Found Datasheets File :: 314 Search Time::1.625ms
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				Hittite Microwave Corporation
Part No.	HMC519
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 18 - 32 GHz
File Size	306.71K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC518
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz
File Size	291.06K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC517
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 17 - 26 GHz
File Size	286.67K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC516
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 17 GHz
File Size	289.37K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH216
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 14 - 27 GHz
File Size	187.67K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-APH403
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT MMIC POWER AMPLIFIER GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 37 - 45 GHz
File Size	216.57K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-APH460
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT MMIC POWER AMPLIFIER GaAs HEMT MMIC 0.5 WATT POWER AMPLIFIER, 27 - 31.5 GHz
File Size	224.01K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC-ALH44510
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. dc bonds of 0.001 (0.025 mm) diameter, thermosonically bonded, are recommended. ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. ...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 18 - 40 GHz
File Size	248.29K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-APH478 H478
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	18000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER GaAs HEMT MMIC 1 WATT POWER AMPLIFIER, 18 - 20 GHz GaAs HEMT MMIC POWER AMPLIFIER
File Size	205.07K / 6 Page	View it Online	Download Datasheet

For bonded-pair Found Datasheets File :: 314 Search Time::1.625ms
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