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TI store
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| Part No. |
TMS320F2812PGFA TMS320F2810 TMS320F2810PBKA TMS320F2812GHHA
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| OCR Text |
...two footnotes to the electrical characterisitcs over recommended operating conditions table (section 6.3) 92 added vdd1 to the first footnote of the current consumption by power-supply pins over recommended operating conditions during low-... |
| Description |
Digital Signal Processors
<font color=red>[Old version datasheet]</font> Digital Signal Processors
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| File Size |
2,015.25K /
162 Page |
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Union Technologies, Corp.
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| Part No. |
CL05F153ZB5NNND
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| OCR Text |
...anicalbreakdown temperature y5v characterisitcs (from30 to85 ,capacitancechangeshoudbewithin82~+22%) adhesive strength nopeelingshallbeoccuronthe 500g ? f,for101sec. of termination terminalelectrode bending strength capacitancechange: wit... |
| Description |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.015 uF, SURFACE MOUNT, 0402 CHIP, HALOGEN FREE & ROHS COMPLIANT
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| File Size |
77.79K /
2 Page |
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Moeller Electric, Corp.
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| Part No. |
CL10F154ZO8NNNC
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| OCR Text |
...anicalbreakdown temperature y5v characterisitcs (from30 to85 ,capacitancechangeshoudbewithin82~+22%) adhesive strength nopeelingshallbeoccuronthe 500g ? f,for101sec. of termination terminalelectrode bending strength capacitancechange: wit... |
| Description |
CAPACITOR, CERAMIC, MULTILAYER, 16 V, Y5V, 0.15 uF, SURFACE MOUNT, 0603 CHIP, HALOGEN FREE & ROHS COMPLIANT
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| File Size |
77.94K /
2 Page |
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it Online |
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Samsung Semiconductor Co., Ltd.
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| Part No. |
CL21F154ZBCNNNC
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| OCR Text |
...anicalbreakdown temperature y5v characterisitcs (from30 to85 ,capacitancechangeshoudbewithin82~+22%) adhesive strength nopeelingshallbeoccuronthe 500g ? f,for101sec. of termination terminalelectrode bending strength capacitancechange: wit... |
| Description |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.15 uF, SURFACE MOUNT, 0805 CHIP, HALOGEN FREE & ROHS COMPLIANT
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| File Size |
77.62K /
2 Page |
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it Online |
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Samsung Semiconductor Co., Ltd.
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| Part No. |
CL21F334ZBFNNNE
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| OCR Text |
...anicalbreakdown temperature y5v characterisitcs (from30 to85 ,capacitancechangeshoudbewithin82~+22%) adhesive strength nopeelingshallbeoccuronthe 500g ? f,for101sec. of termination terminalelectrode bending strength capacitancechange: wit... |
| Description |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.33 uF, SURFACE MOUNT, 0805 CHIP, HALOGEN FREE & ROHS COMPLIANT
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| File Size |
77.96K /
2 Page |
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it Online |
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Samsung Semiconductor Co., Ltd.
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| Part No. |
CL31F334ZBCNNNC
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| OCR Text |
...anicalbreakdown temperature y5v characterisitcs (from30 to85 ,capacitancechangeshoudbewithin82~+22%) adhesive strength nopeelingshallbeoccuronthe 500g ? f,for101sec. of termination terminalelectrode bending strength capacitancechange: wit... |
| Description |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.33 uF, SURFACE MOUNT, 1206 CHIP, HALOGEN FREE AND ROHS COMPLIANT
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| File Size |
78.12K /
2 Page |
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it Online |
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Accutek Microcircuit, Corp.
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| Part No. |
CL32A106MOJNNNE
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| OCR Text |
...nical breakdown temperature x5r characterisitcs (from -55 to 85 , capacitance change shoud be within 15%) adhesive strength no peeling shall be occur on the 500g ? f, for 101 sec. of termination terminal electrode bending strength capaci... |
| Description |
CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 10 uF, SURFACE MOUNT, 1210 CHIP, HALOGEN FREE & ROHS COMPLIANT
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| File Size |
134.34K /
2 Page |
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it Online |
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Accutek Microcircuit, Corp.
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| Part No. |
CL32A226MOJNNNE
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| OCR Text |
...nical breakdown temperature x5r characterisitcs (from -55 to 85 , capacitance change shoud be within 15%) adhesive strength no peeling shall be occur on the 500g ? f, for 101 sec. of termination terminal electrode bending strength capaci... |
| Description |
CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 22 uF, SURFACE MOUNT, 1210 CHIP, HALOGEN FREE & ROHS COMPLIANT
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| File Size |
134.60K /
2 Page |
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it Online |
Download Datasheet |
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