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Intel, Corp.
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Part No. |
NG80960JD-40 INTELCORP-NG80960JD-50
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OCR Text |
...document. except as provided in intels terms and conditions of sale for such products, intel assumes no liability whatsoever, and intel disclaims any express or implied warranty, relating to sale and/or use of intel products including liabi... |
Description |
3.3 V EMBEDDED 32-BIT MICROPROCESSOR 32-BIT, 40 MHz, RISC PROCESSOR, PQFP132
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File Size |
711.94K /
59 Page |
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SIEMENS AG
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Part No. |
HYS72V32301GR-7.5 HYS72V64300GR-7.5 HYS72V16300GR-7.5 HYS72V32300GR-7.5 HYS72V16301GR-7.5 HYS72V128320GR-7.5
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OCR Text |
...ble with the current pc133 and intels pc100 specifications ? performance: -7.5 unit f ck clock frequency (max.) @ cl = 3 133 mhz t ck clock cycle time (min.) @ cl = 3 7.5 ns t ac clock access time (min.) cas latency = 3 5.4 ns
hys 72v... |
Description |
3.3V 256MB SDRAM Module(3.3V 256MSDRAM 模块) 3.3V 128MB SDRAM Module(3.3V 128MSDRAM 模块) 3.3V 1GB SDRAM Module(3.3V 1GSDRAM 模块) 3.3V 256MB SDRAM Module(3.3V 256MSDRAM 模块) 3.3 256MB的内存模块(3.3 256M位内存模块) 3.3V 128MB SDRAM Module(3.3V 128MSDRAM 模块) 3.3 128MB的内存模块(3.3V28兆位内存模块
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File Size |
231.38K /
19 Page |
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Rochester Electronics
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Part No. |
8251A TD8251A LD8251A QP8251A QD8251A
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OCR Text |
.... the chip is fabricated using intels high performance hmos technology.
page 2 of 11 rochester part number ocm part number package temperature d8251a d8251a dip-28 0 to +70c id8251a id8251a dip-28 -40 to +85c ld8251a ld8251a dip-28 -40 t... |
Description |
PROGRAMMABLE COMMUNICATION INTERFACE 28-Pin DIP Package PROGRAMMABLE COMMUNICATION INTERFACE 28-Pin DIP Package
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File Size |
562.45K /
11 Page |
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Standard Microsystems
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Part No. |
82443BX
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OCR Text |
...ighly integrated version of the intels pci-isa bridge family. the intel ? 440bx agpset is ideal for the mobile agpset pentium ii processor platforms; providing full support for all system suspend modes and segmented power planes. intel ... |
Description |
Host Bridge Datasheet
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File Size |
646.35K /
132 Page |
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