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    XILINX[Xilinx, Inc]
Part No. XQ2V1000-4FG456N XQ2V6000-4FG456N XQ2V1000 XQ2V1000-4BG575M XQ2V1000-4BG575N XQ2V1000-4BG728M XQ2V1000-4BG728N XQ2V1000-4CF1144M XQ2V1000-4CF1144N XQ2V1000-4CG717M XQ2V1000-4CG717N XQ2V1000-4FG456M XQ2V3000 XQ2V3000-4BG575M XQ2V3000-4BG575N XQ2V3000-4BG728M XQ2V3000-4BG728N XQ2V3000-4CF1144M XQ2V3000-4CF1144N XQ2V3000-4CG717M XQ2V3000-4CG717N XQ2V3000-4FG456M XQ2V3000-4FG456N XQ2V6000 XQ2V6000-4BG575M XQ2V6000-4BG575N XQ2V6000-4BG728M XQ2V6000-4BG728N XQ2V6000-4CF1144M XQ2V6000-4CF1144N XQ2V6000-4CG717M XQ2V6000-4CG717N XQ2V6000-4FG456M
OCR Text ...nect is used in some of the CGA offerings. The use of flip-chip interconnect offers more I/Os than is possible in wire-bond versions of the similar packages. Flip-chip construction offers the combination of high pin count with high thermal ...
Description QPro Virtex-II 1.5V Military QML Platform FPGAs

File Size 2,753.27K  /  128 Page

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    44170-0001 44170-0002 44170-0003 44170-0004 44170-0005 44170-0006

Molex Electronics Ltd.
Part No. 44170-0001 44170-0002 44170-0003 44170-0004 44170-0005 44170-0006
OCR Text ...Lower electrical noise than LED offerings 30% fewer leads than LED offerings Space saving design Electrical Voltage: 125V Current: 1.5A max. Contact Resistance: 10m max. Dielectric Withstanding Voltage: 1000V AC Insulation Resistance: 50...
Description Molex隆炉s New Stacked Multi-port Modular Jack with Lightpipes Exceeds Category 5 Level Performance
Molex’s New Stacked Multi-port Modular Jack with Lightpipes Exceeds Category 5 Level Performance

File Size 361.65K  /  2 Page

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    XQ2V6000-5EF957I XQ2V1000-EF957I XQ2V3000-EF957I XQ2V6000-EF957I XQ2V1000-EF957M XQ2V3000-EF957M XQ2V6000-EF957M XQ2V100

Xilinx, Inc
Part No. XQ2V6000-5EF957I XQ2V1000-EF957I XQ2V3000-EF957I XQ2V6000-EF957I XQ2V1000-EF957M XQ2V3000-EF957M XQ2V6000-EF957M XQ2V1000-EF957N XQ2V3000-EF957N XQ2V6000-EF957N XQ2V1000-CG717I XQ2V3000-CG717I XQ2V6000-CG717I XQ2V3000-4CG717M XQ2V1000-CG717M XQ2V3000-CG717M XQ2V6000-CG717M XQ2V1000-CG717N XQ2V3000-CG717N XQ2V6000-CG717N XQ2V1000-4BG575N XQ2V3000-4BG728N XQ2V1000-CF1144I XQ2V3000-CF1144I XQ2V6000-CF1144I XQ2V6000-4CF1144M XQ2V1000-CF1144M XQ2V3000-CF1144M XQ2V6000-CF1144M XQ2V1000-CF1144N XQ2V3000-CF1144N XQ2V6000-CF1144N
OCR Text ...tails in Table 2. Packaging offerings include ball grid array (BGA) packages with 1.00 mm and 1.27 mm pitches. In addition to traditional wire-bond interconnects, flip-chip interconnect is used in some of the CGA offerings. The use of f...
Description QPro Virtex-II 1.5V Platform FPGAs

File Size 1,654.87K  /  134 Page

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    EP2S60 EP2S30

Altera Corporation
Part No. EP2S60 EP2S30
OCR Text ...s the Stratix II device package offerings and shows the total number of non-migratable user I/O pins when migrating from one density device to a larger density device. Additional I/O pins may not be migratable if migrating from the larger d...
Description Stratix II Device Family

File Size 1,250.14K  /  238 Page

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    RTAX250-SCG624B RTAX250-SCG624E RTAX250-SCG624EV RTAX250-SCQ624EV RTAX250-SLB624B RTAX250-SLB624E RTAX250-SLB624EV RTAX2

Actel Corporation
Part No. RTAX250-SCG624B RTAX250-SCG624E RTAX250-SCG624EV RTAX250-SCQ624EV RTAX250-SLB624B RTAX250-SLB624E RTAX250-SLB624EV RTAX250-SLCG624B RTAX250-SLCG624E RTAX250-SLCG624EV RTAX2000-SLCG624EV RTAX-S RTAX1000-SS624B RTAX2000-SS624B RTAX250-SS624B RTAX4000-SS624B RTAX1000-SS624E RTAX2000-SS624E RTAX250-SS624E RTAX4000-SS624E RTAX1000-SS624EV RTAX2000-SS624EV RTAX250-SS624EV RTAX4000-SS624EV RTAX2000-SLCQ624E
OCR Text ...ma Column. Temperature Grade offerings Package CQ208 CQ256 CQ352 CG624*/LG624 CG1152/LG1152 CG1272/LG1272 RTAX250S/SL B, E, EV - B, E, EV - - - RTAX1000S/SL - - B, E, EV B, E, EV - - RTAX2000S/SL - B, E, EV B, E, EV B, E, EV B, E, EV - ...
Description RTAX-S/SL RadTolerant FPGAs

File Size 2,198.26K  /  170 Page

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    L9D340G64BG2 L9D340G64BG2E19 L9D340G64BG2I15 L9D340G64BG2M25

LOGIC Devices Incorporated
Part No. L9D340G64BG2 L9D340G64BG2E19 L9D340G64BG2I15 L9D340G64BG2M25
OCR Text ... our Part Catalog for available offerings. TABLE 2: ADDRESSING Parameter Configuration Refresh Count ROW Addressing Back Addressing Column Addressing 64 Meg x 64 [8 Meg x 8 banks x 16] x 4 8K 8K (A[12:0]) 8 (BA[2:0]) 1K (A[9:0]) ...
Description 4.0 Gb, DDR3, 64 M x 64 Integrated Module (IMOD)

File Size 3,249.49K  /  155 Page

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    Integrated Silicon Solu...
Part No. IS66WVE1M16EBLL-55BLI IS66WVE1M16TALL-70BLI IS66WVE1M16TBLL-70BLI IS66WVE1M16TCLL-70BLI IS66WVE1M16TBLL-55BLI IS66WVE1M16ECLL-70BLI IS66WVE1M16EALL-70BLI IS66WVE1M16EBLL-70BLI
OCR Text ...r sram or pseudo - sram (psram) offerings. for seamless operation on an asynchronous memory bus, psram products incorporated a transparent self - refresh mechanism. the hidden refresh requires no additional support from the system mem...
Description    16Mb Async/Page PSRAM

File Size 493.30K  /  34 Page

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    MT4LC16M4G3 MT4LC16M4G3DJ-5 MT4LC16M4G3DJ-5S MT4LC16M4G3DJ-6 MT4LC16M4G3DJ-6S MT4LC16M4G3TG-5 MT4LC16M4G3TG-5S MT4LC16M4

MICRON[Micron Technology]
Part No. MT4LC16M4G3 MT4LC16M4G3DJ-5 MT4LC16M4G3DJ-5S MT4LC16M4G3DJ-6 MT4LC16M4G3DJ-6S MT4LC16M4G3TG-5 MT4LC16M4G3TG-5S MT4LC16M4G3TG-6 MT4LC16M4G3TG-6S MT4LC16M4H9DJ-5 MT4LC16M4H9DJ-5S MT4LC16M4H9DJ-6 MT4LC16M4H9DJ-6S MT4LC16M4H9TG-5 MT4LC16M4H9TG-5S MT4LC16M4H9TG-6 MT4LC16M4H9TG-6S
OCR Text ... base number differentiates the offerings in one place-- MT4LC16M4H9. The fifth field distinguishes the address offerings: H9 designates 4K addresses and G3 designates 8K addresses. 2. The "#" symbol indicates signal is active LOW. *Contact...
Description DRAM

File Size 373.17K  /  22 Page

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    Integrated Silicon Solu...
Part No. IS66WVE2M16ALL
OCR Text ...r sram or pseudo - sram (psram) offerings. for seamless operation on an asynchronous memory bus, psram products incorporated a transparent self - refresh mechanism. the hidden refresh requires no additional support from the system mem...
Description    Asynchronous and page mode interface

File Size 479.51K  /  30 Page

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    EP2S90 EP2S130 EP2S15

Altera Corporation
Part No. EP2S90 EP2S130 EP2S15
OCR Text ...s the Stratix II device package offerings and shows the total number of non-migratable user I/O pins when migrating from one density device to a larger density device. Additional I/O pins may not be migratable if migrating from the larger d...
Description Stratix II Device Family

File Size 1,179.17K  /  238 Page

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For offerings Found Datasheets File :: 1355    Search Time::3.797ms    
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