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For pads Found Datasheets File :: 14862 Search Time::1.281ms
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				STMICROELECTRONICS[STMicroelectronics] ST Microelectronics
Part No.	STLC2410B STLC2410
OCR Text	...ly voltage digital core and emi pads Supply voltage digital IO Operating ambient temperature Min 1.55 2.7 -40 Typ 1.8 3.3 Max 1.95 3.6 +85 Unit V V C 3.3 I/O specifications Depending on the interface, the I/O voltage is typical 1.8V (int...
Description	BLUETOOTH BASEBAND
File Size	167.94K / 20 Page	View it Online	Download Datasheet

				STMICROELECTRONICS[STMicroelectronics]
Part No.	STLC2415
OCR Text	...y voltage baseband core and EMI pads Supply voltage flash Supply voltage baseband I/O Supply voltage flash I/O (VDDQ VDDF) Operating ambient temperature Min 1.55 1.55 2.7 1.55 -40 Typ 1.8 1.8 3.3 1.8 Max 1.95 1.95 3.6 1.95 +85 Unit V V V V...
Description	BLUETOOTH BASEBAND WITH INTEGRATED FLASH
File Size	160.51K / 22 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	XX1002
OCR Text	...de Metallization: Gold All Bond pads are 0.200 x 0.100 (0.008 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.566 mg. Bond Pad #1 (RF In) ...
Description	2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler
File Size	370.74K / 5 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	XS1000
OCR Text	...de Metallization: Gold All Bond pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.88 mg. Bond Pad #1 (RF In) B...
Description	7.0-13.0 GHz GaAs MMIC 6-Bit Phase Shifter
File Size	498.75K / 6 Page	View it Online	Download Datasheet

				Comchip Technology Co., Ltd.
Part No.	TV15C170J TV15C170JB TV15C170K TV15C170KB TV15C171J TV15C171JB TV15C171K TV15C450JB TV15C131K COMCHIPTECHNOLOGYCO.LTD.-TV15C131KB TV15C131JB TV15C540JB TV15C480JB
OCR Text	... Mounted on 8.0x8.0 mm . Copper pads to Each Terminal. 3. Measured on 8.3 mS Single Half Sine-Wave or Equivalent Square Wave, Duty Cycle=4 Pulse per Minute Maximum. 4. VF=3.5V on TV15C5V0 thru TV15C900 Devices and VF=5.0V on TV15C101 thru T...
Description	SMD Transient Voltage Suppressor 贴片瞬态电压抑制器
File Size	112.45K / 4 Page	View it Online	Download Datasheet

				Comchip Technology Co., Ltd. TE Connectivity, Ltd.
Part No.	TV30C5V0 TV30C200KB TV30C240JB TV30C540J TV30C100KB COMCHIPTECHNOLOGYCO.LTD.-TV30C6V0JB TV30C780J COMCHIPTECHNOLOGYCO.LTD.-TV30C360JB TV30C480J TV30C140J TV30C780JB TV30C600KB TV30C480JB TV30C200K TV30C100J
OCR Text	... Mounted on 8.0x8.0 mm . Copper pads to Each Terminal. 3. Measured on 8.3 mS Single Half Sine-Wave or Equivalent Square Wave, Duty Cycle=4 Pulse per Minute Maximum. 4. VF=3.5V on TV30C5V0 thru TV30C900 Devices and VF=5.0V on TV30C101 thru T...
Description	SMD Transient Voltage Suppressor SMD Transient Voltage Suppressor 贴片瞬态电压抑制器
File Size	94.75K / 4 Page	View it Online	Download Datasheet

				United Monolithic Semiconductors
Part No.	CHA6517 CHA6517-99F_00 CHA6517-99F/00
OCR Text	... both RF and DC grounded * bond pads and back side are gold plated for compatibility with eutectic die attach method and thermosonic or thermocompression bonding process. Output Power versus Frequency Vg Vd3 Main Features 0.25 ...
Description	6 - 18 GHz High Power Amplifier
File Size	428.64K / 10 Page	View it Online	Download Datasheet

				United Monolithic Semiconductors
Part No.	CHA6518
OCR Text	... both RF and DC grounded * bond pads and back side are gold plated for compatibility with eutectic die attach method and thermosonic or thermocompression bonding process. Vg Vg Vd Main Features n n n n n n 0.25 m Power pHEMT Technology...
Description	5 - 18 GHz High Power Amplifier
File Size	323.48K / 8 Page	View it Online	Download Datasheet

For pads Found Datasheets File :: 14862 Search Time::1.281ms
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