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XXXSE FR104 JQAM1 BZX70C39 00BZI EF68B09E MAX1842 Z25LA511
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  placement Datasheet PDF File

For placement Found Datasheets File :: 14212    Search Time::0.781ms    
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    OKI[OKI electronic componets]
Part No. ML70Q5111LA
OCR Text ...conductor ML70Q5111LA PIN placement 1 NC A PLL_LE B RX_ POW C PLL_ OFF D PLL_ CLK E RXD F VDD G CIO15 H CIO12 J CIO9 K CIO6 L CIO4 M NC N 2 PLL_PS 3 PLL LOCK 4 GND MWE 5 MRE 6 GND 7 D- 8 TEST_L 9 10 11...
Description Bluetooth Baseband Controller IC

File Size 144.13K  /  26 Page

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    HPD15-48D12 HPD15-48D15 HPD15-48S05 HPD15-48S15 HPD15-48T05-12 HPD15-24T05-12 HPD15-24T05-15 HPD15 HPD15-12S05 HPD15-12S

ARTESYN[Artesyn Technologies]
Part No. HPD15-48D12 HPD15-48D15 HPD15-48S05 HPD15-48S15 HPD15-48T05-12 HPD15-24T05-12 HPD15-24T05-15 HPD15 HPD15-12S05 HPD15-12S2V1 HPD15-12S3V3 HPD15-48T05-15 HPD15-12D05 HPD15-12D12 HPD15-12D15 HPD15-12S12 HPD15-12S15 HPD15-12T05-12 HPD15-12T05-15 HPD15-24D05 HPD15-24D12 HPD15-24D15 HPD15-24S05 HPD15-24S12 HPD15-24S15 HPD15-24S2V1 HPD15-24S3V3 HPD15-48D05 HPD15-48S12 HPD15-48S2V1 HPD15-48S3V3
OCR Text ...rance : 0.008 (0.2) max. on pin placement 0.02 (0.5) max. on outer dimensions ALL DIMENSIONS IN INCHES (mm) Tolerance : 0.008 (0.2) max. on pin placement 0.02 (0.5) max. on outer dimensions Pinout (Triple) 0.24 (6.00) 0.50 (12.70) 0....
Description Single, dual and triple output 15 Watt Wide input DC/DC converters

File Size 45.91K  /  3 Page

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    Sanyo Electric Co.,Ltd.
SANYO[Sanyo Semicon Device]
Part No. T8LNP
OCR Text ...ards table after 1 hour or more placement at normal temperature and humidity. Should satisfy the determinations standards table after 1 hour or more placement at normal temperature and humidity. Should satisfy the determinations standards t...
Description Stepping Motor
From old datasheet system

File Size 195.02K  /  6 Page

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    TDA1308T TDA1308

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TDA1308T TDA1308
OCR Text ...outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer o...
Description Class AB stereo headphone driver

File Size 107.13K  /  12 Page

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    NPTB00004A NPTB00004A-15

M/A-COM Technology Solutions, Inc.
M/A-COM Technology Solu...
Part No. NPTB00004A NPTB00004A-15
OCR Text ...e noted) figure 4: component placement of 2.5 ghz narrowband circuit for nptb00004a reference value manufacturer part number c1, c6 1f avx 12101c105kat2a c2, c7 0.1f murata grm188r72a104ka35d c3, c8 0.01f ...
Description Gallium Nitride 28V, 5W, DC-6 GHz HEMT

File Size 2,231.22K  /  10 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA1319B-EPU
OCR Text ...itrogen atmosphere Component placement and adhesive attachment assembly notes: *= *= *= *= *= *= *= vacuum pencils and/or vacuum collets preferred method of pick up avoidance of air bridges during placement force impact critical during a...
Description Ka Band Low Noise Amplifier

File Size 769.31K  /  5 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA1319C-EPU TRIQUINTSEMICONDUCTORINC-TGA1319C-EPU
OCR Text ...trogen atmosphere. Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description Ka Band Wideband LNA/Driver

File Size 214.80K  /  6 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA1319C
OCR Text ...itrogen atmosphere Component placement and adhesive attachment assembly notes: *= *= *= *= *= *= *= vacuum pencils and/or vacuum collets preferred method of pick up avoidance of air bridges during placement force impact critical during a...
Description Ka Band Wideband LNA/Driver

File Size 364.76K  /  3 Page

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For placement Found Datasheets File :: 14212    Search Time::0.781ms    
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