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Filtronic Compound Semi... FILTRONIC[Filtronic Compound Semiconductors]
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Part No. |
LP7612
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OCR Text |
...die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is one minute. The recommended wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0... |
Description |
HIGH DYNAMIC RANGE PHEMT
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File Size |
38.11K /
2 Page |
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it Online |
Download Datasheet
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Motorola
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Part No. |
MPXH6300A
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OCR Text |
...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to
0.050 1.27 TYP 0.150 3.81
a solder reflow process. It is always... |
Description |
High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure From old datasheet system
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File Size |
104.11K /
8 Page |
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it Online |
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INFINEON[Infineon Technologies AG]
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Part No. |
SIDC11D60SIC3
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OCR Text |
...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 250m 0.3 mm store in original container, in...bond configuration)
Symbol VRRM V RSM IF I FSM I FRM I FMAX Tj , Ts t g
Condition
Value 600... |
Description |
Silicon Carbide Schottky Diode 碳化硅肖特基二极
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File Size |
53.74K /
4 Page |
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it Online |
Download Datasheet
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Price and Availability
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