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For solder-solder Found Datasheets File :: 110169 Search Time::3.079ms
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				Vishay Siliconix Vishay Telefunken
Part No.	TLMC3101
OCR Text	...infrared, vapor phase and wave solder processes according to CECC D Available in 8 mm tape D Low profile package D Non-diffused lens: excellent for coupling to light pipes and backlighting D Very low power consumption D Luminous int...
Description	From old datasheet system Low Current SMD LED
File Size	77.84K / 6 Page	View it Online	Download Datasheet

				NEC Corp. NEC[NEC]
Part No.	UPC339C UPC339G2 UPC339 C339C
OCR Text	...er of reflow processes: 1 time. Solder temperature: 260 C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 C or below (Package surface temperature). Pin temperature: 300 C or be...
Description	LOW POWER QUAD COMPARATOR
File Size	59.67K / 12 Page	View it Online	Download Datasheet

				Sanyo Electric Co.,Ltd. Sanyo Semicon Device
Part No.	VP503
OCR Text	... to apply the grease evenly. 5. Solder the IC leads to the printed circuit board after mounting the heat sink to the IC. Note: The heat sink is absolutely required to operate this Video Pack. Never, in any situation, apply power to a Video ...
Description	CRT Display Video Output Amplifier: High-Voltage/ Wideband Amplification CRT Display Video Output Amplifier: High-Voltage, Wideband Amplification
File Size	234.65K / 11 Page	View it Online	Download Datasheet

				Panasonic Corporation PANASONIC[Panasonic Semiconductor]
Part No.	2SB1604 2SB1604A
OCR Text	...13.7-0.2 +0.5 4.10.2 8.00.2 Solder Dip 3.00.2 Low collector to emitter saturation voltage VCE(sat) High-speed switching Full-pack package with outstanding insulation, which can be installed to the heat sink with one screw Ratin...
Description	Silicon PNP epitaxial planar type(For low-voltage switching)
File Size	54.60K / 3 Page	View it Online	Download Datasheet

				PANASONIC[Panasonic Semiconductor]
Part No.	2SD1271 2SD1271A
OCR Text	...temperature V V A A W C C Solder Dip 4.0 7.50.2 1:Base 2:Collector 3:Emitter TO-220 Full Pack Package(a) s Electrical Characteristics Parameter Collector cutoff current Emitter cutoff current Collector to emitter voltage ...
Description	Silicon NPN epitaxial planar type(For power switching)
File Size	57.45K / 3 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	74AHCT1G00 74AHCT1G00GW 74AHC1G00 74AHC1G00GW
OCR Text	...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement....
Description	2-input NAND gate
File Size	80.05K / 12 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	74AHCT1G02 74AHCT1G02GW 74AHC1G02 74AHC1G02GW
OCR Text	...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement....
Description	2-input NOR gate
File Size	80.65K / 12 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	74AHCT1G04 74AHCT1G04GW 74AHC1G04 74AHC1G04GW
OCR Text	...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement....
Description	Inverter
File Size	79.87K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	74AHCT1G08 74AHCT1G08GW 74AHC1G08 74AHC1G08GW
OCR Text	...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement....
Description	2-input AND gate
File Size	80.01K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	74AHCT1G32 74AHCT1G32GW 74AHC1G32 74AHC1G32GW 74AHC1G32GW/T1
OCR Text	...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement....
Description	IC-SM-CMOS LOGIC 2-input OR gate
File Size	80.51K / 12 Page	View it Online	Download Datasheet

For solder-solder Found Datasheets File :: 110169 Search Time::3.079ms
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