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    FPD3000 FPD30001

Filtronic Compound Semiconductors
Part No. FPD3000 FPD30001
OCR Text ... recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is one minute. The recommended wire bond method is thermo-compression wedge bonding with 0.7 ...
Description 2W POWER PHEMT

File Size 116.53K  /  3 Page

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    HMC-APH462

Hittite Microwave Corporation
Part No. HMC-APH462
OCR Text ...tectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool temperature of 265 C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 C. DO NOT expose the ch...
Description GaAs HEMT MMIC 1 WATT POWER AMPLIFIER, 15 - 27 GHz

File Size 232.68K  /  6 Page

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    LTD121KA0S

Toshiba Semiconductor
Part No. LTD121KA0S
OCR Text ...8 4 ole*j 8 3 *iou- gH 3 5 Mn O tin 3 .3 I /F C: D1 L 0 -1 (HRS) N F 9 -2 P H I OE 2 0 1 2 .5 0 /-0 (M n Hl efo D itize .5+ .3 o t o r...au LAAACUOENLDOW*ZI**C O OLENFA SEEL. 'nZ(c)ASU**B C DNO E C O PA K*]"puI3/4 L M O G IO R O ` u `I -...
Description 31cm COLOUR TFT-LCD MODULE

File Size 91.33K  /  11 Page

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    SMBG40 SMBG100 SMBG5.0 SMBG5.0A SMBG5.0A-E3_52 SMBG5.0A-E3_5B SMBG5.0AHE3_52 SMBG5.0AHE3_5B SMBG40A SMBG20 SMBG78 SMBG6.

Vishay Siliconix
Part No. SMBG40 SMBG100 SMBG5.0 SMBG5.0A SMBG5.0A-E3_52 SMBG5.0A-E3_5B SMBG5.0AHE3_52 SMBG5.0AHE3_5B SMBG40A SMBG20 SMBG78 SMBG6.0 SMBG6.0A SMBG6.5 SMBG6.5A SMBG30 SMBG60 SMBG60A SMBG54A SMBG160A SMBG7.0 SMBG7.0A SMBG7.5 SMBG7.5A SMBG70 SMBG70A SMBG130 SMBG15A SMBG18 SMBG10 SMBG100A SMBG10A SMBG11 SMBG110 SMBG110A SMBG12 SMBG90A SMBG43 SMBG26 SMBG20A SMBG16 SMBG130A SMBG13A SMBG58A SMBG150 SMBG150A SMBG78A SMBG33 SMBG160 SMBG16A SMBG22 SMBG22A SMBG24 SMBG24A SMBG15 SMBG188CA SMBG170 SMBG45A SMBG120 SMBG120A SMBG12A SMBG188A SMBG51A SMBG18A SMBG85A SMBG170A SMBG17A SMBG5.0AHE3/5B SMBG5.0A-E3/52 SMBG5.0A-E3/5B SMBG5.0AHE3/52 SMBG8.0A SMBG8.5A SMBG9.0A SMBG33A SMBG64 SMBG13 SMBG75A SMBG64A SMBG26A SMBG9.0 SMBG14A SMBG54 SMBG36A
OCR Text ...101 qualified) Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix meets JESD 201 class 1A whisker test, H...au AV AW AX KY KZ BD BE LF LG BH BK BL BM LN LM LQ LR BS BT LU LV BW BX BY BZ CD CE MF MG CH CK CL C...
Description Surface Mount TRANSZORB㈢ Transient Voltage Suppressors
Surface Mount TRANSZORB垄莽 Transient Voltage Suppressors
Surface Mount TRANSZORB庐 Transient Voltage Suppressors
Surface Mount TRANSZORB? Transient Voltage Suppressors

File Size 112.81K  /  6 Page

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    RH00515R00125AE01 RH00515R00125AE02 RH00515R00125BE01 RH00515R00125BE02 RH00515R00125CE01 RH00515R00125CE02 RH00515R0012

Vishay Siliconix
Part No. RH00515R00125AE01 RH00515R00125AE02 RH00515R00125BE01 RH00515R00125BE02 RH00515R00125CE01 RH00515R00125CE02 RH00515R00125DE01 RH00515R00125DE02 RH00515R00125FE01 RH00515R00125FE02 RH250 RH0054K125AE01 RH0054K125AE02 RH0054K125BE01 RH0054K125BE02 RH050 NH050 RH0054R125AE01 RH0054R125AE02 RH0054R125BE01 RH0054R125BE02 RH0054R125CE01 RH0054R125CE02 RH0054R125DE01 RH0054R125DE02 RH0054R125FE01 RH0054R125FE02 RH0054L125CE01 RH0054K125CE01 RH0058L000125CE01 RH0054L125CE02 RH0054K125CE02 RH0058L000125CE02 RH010 RH0058L000125AE01 RH0058L000125AE02 RH0058L000125BE01 RH0058L000125BE02 RH0058L000125DE01 RH0058L000125DE02 RH0058L000125FE01 RH0058L000125FE02 RH100 RH0054L125AE01 RH0054L125AE02 RH0054L125BE01 RH0054L125BE02 RH0054L125DE01 RH0054L125DE02 RH0054L125FE01 RH0054L125FE02 RH025 NH005 RH0054K125DE01 RH0054K125DE02 RH0054K125FE01 RH0054K125FE02 NH250 NH100
OCR Text ...lable on RE military type C02 = tin/lead, card pack (RH005 - RH050) J01 = tin/lead, skin pack (RH100 and RH250) 1% TOLERANCE CODE Histori...au, finish is on copper clad steel core terminal. For RH-100 and RH-250 terminals are threaded stain...
Description Wirewound Resistors, Military, MIL-PRF-18546 Qualified, Type RE, Aluminum Housed, Chassis Mount

File Size 217.32K  /  5 Page

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    DB-2933-54

http://
STMicroelectronics
Part No. DB-2933-54
OCR Text ...led ceramic-capped transistors. tin and wash the printedcircuit board BEFORE mounting the power transistors, then solder the transistor lead...au (100 min) over Ni(100 min) + Pd Ni (100 min / (10 min) 350 max) 0.6 0.75 M174 (Moly disk...
Description RF POWER amplifier using 2 x SD2933 N-Channel enhancement-mode lateral MOSFETs

File Size 655.22K  /  13 Page

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    HMC-ABH2410712

Hittite Microwave Corporation
Part No. HMC-ABH2410712
OCR Text ...tectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool temperature of 265 C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 C. DO NOT expose the ch...
Description GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 50 - 66 GHz

File Size 216.97K  /  6 Page

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    HMC-ABH209

Hittite Microwave Corporation
Part No. HMC-ABH209
OCR Text ...tectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool temperature of 265 C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 C. DO NOT expose the ch...
Description GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 55 - 65 GHz

File Size 181.58K  /  6 Page

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    48206-0001 48206-0002 48206-0003 48206-0004 48206-0005 48206-0006 48206-0101 48206-0102 48206-0103 48206-0104 48206-0105

Molex Electronics Ltd.
Part No. 48206-0001 48206-0002 48206-0003 48206-0004 48206-0005 48206-0006 48206-0101 48206-0102 48206-0103 48206-0104 48206-0105 48206-0106 48206-9001 48206-9002 48206-9003 48206-9004 48206-9005
OCR Text ... order table Solder Tail Area --tin (Sn), Lead-free Underplating -- Nickel Operating Temperature: +260C max. MARKETS AND APPLICATIONS ...au) 0.76m (30") Gold (au) 0.38m (15") Gold (au) Features Solder Tail Length Latch Color Housing R...
Description Fully Buffered DIMM Socket 240 CircuitWith Color Options

File Size 157.28K  /  3 Page

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    EMP213

Excelics Semiconductor, Inc.
Part No. EMP213
OCR Text ...attach should be done with Gold/tin (80/20) eutectic alloy in inert ambient gas. The backside is used as heatsinking, DC, and RF contacts. All die attach and wire bond equipment, especially the tools which touch a die, should be well ground...
Description 12.5 - 15.5 GHz Power Amplifier MMIC

File Size 197.62K  /  4 Page

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For tin au Found Datasheets File :: 8657    Search Time::1.047ms    
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