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OSRAM
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Part No. |
F0118G
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OCR Text |
...measurement uncertainties. Each wafer and fragment of a wafer is subject to final testing. The wafer or its pieces are individually attached...carrier for measurement purposes. The sampling density is one chip per 2 cm. If a sample fails, the ... |
Description |
GaAs Infrared Emitting Diode
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File Size |
65.53K /
6 Page |
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Osram Opto Semiconductors GmbH OSRAM[OSRAM GmbH]
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Part No. |
F2000D
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OCR Text |
...measurement uncertainties. Each wafer and fragment of a wafer is subject to final testing. The wafer or its pieces are individually attached...carrier for measurement purposes. Sample-test: Sampling density/samples per cm (grid): 1,6/cm. If a ... |
Description |
InGaAlP-High Brightness-Lumineszenzdiode (617nm, High Current and Flux), InGaAlP High Brightness LED (617nm, High Current and Flux)
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File Size |
211.09K /
6 Page |
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Microchip Technology Inc.
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Part No. |
DV103001 DV103002 DV103003
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OCR Text |
...available in bumped or bondable wafer format which makes them suitable for smart labels and flip-chip style assembly. package options include: die, wafer, wafer-on- frame, bumped wafer-on-frame, pdip, soic and cob modules. microchip deliver... |
Description |
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File Size |
198.81K /
2 Page |
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VISHAY INTERTECHNOLOGY INC
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Part No. |
IR340LM10CS05
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OCR Text |
wafer size: 4" v rrm class: 1000 to 1200 v passivation process: glassivated moat reference ir packaged part: 60epf series fast recovery dio...carrier 4 device code ordering information table 56 7 outline table available class 10 = 1000 v 12... |
Description |
1000 V, SILICON, RECTIFIER DIODE
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File Size |
53.24K /
4 Page |
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it Online |
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Price and Availability
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