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Molex Electronics Ltd.
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| Part No. |
87831-1421 0878311421
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
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| File Size |
218.07K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-3114-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87831-1429 0878311429
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
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| File Size |
189.07K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-420-12LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-422-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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