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Amphenol Communications Solutions |
| Part No. |
77313-422-08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-422-04LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 04 Positions
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| Tech specs |
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Official Product Page
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Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
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| Part No. |
PL342 PL34120191000GDDC PL34120191000KKEX PL34120191000KXDD PL34120191000KXDF PL34120191000GDBX PL34120191000GDDD PL34120191000CFDG PL34120191000MDEG PL34120191000MDBG PL34120191000MHDG PL34120191000MFDG PL34120191000MJDG PL34120191000CFBG PL34120191000CFEG PL34120191000DFDG PL34120191000DFEG PL34120191000MFEG PL34120191000MJBG PL34120191000MHEG PL34120191000MHBG PL34120191000MDDG PL34120191000MFBG PL34120191000GFBC PL34220191000CFBG PL34120191000DHDX PL34120191000DHEX PL34220191000DHBX PL34220191000DHDX PL34220191000DHEX PL34120191000DHBX PL34120191000DHBD PL34120191000DHBC PL34220191000DKBC PL34220191000DJBC PL34220191000BJBC PL34120191000DJBG PL34220191000CXBG PL34220191000FHBG PL34220191000DXBC PL34220191000BHBC PL34120191000DKBG PL34220191000CFBC PL34120191000DXBG PL34220191000CJBC PL34120191000CJBG PL34120191000FHBG PL34220191000CJBG PL34220191000BKBG PL34220191000DHBG PL34120191000CXBG PL34120191000DHBG PL34220191000BHBG PL34220191000BXBG PL34220191000DJBG PL34220191000DXBG PL34220191000FJBG PL34220191000BJBG PL34220191000CDBC PL34220191000CXBC PL34220191000DHBC PL34220191000DKBG PL34120191000MDBD PL34120191000MDBC PL34120191000MDBF PL34120191000MDBX PL34120191000DHEF PL3412
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| Description |
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±14; Dark
Infrared Light Emitting Diodes Top View Type; Type: Surface Mount Type (Sideview); Peak light emitting wavelength P (nm): 950; Half viewing angle
Infrared Light Emitting Diodes Top View Type; Type: Sideview Resin; Peak light emitting wavelength P (nm): 950; Half viewing angle 1/2 (deg): ±
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±32; Dark
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 3.0x2.5(t=2.5); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 1;
Schottky Barrier Diodes; Package: TO220FN; Constitution materials list: Packing style: Bulk; Package quantity: 500;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 81.3; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 2.6x1.6(t=0.8); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 0.7;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 1.9x1.3(t=0.6); Number of terminal: 2; Reverse voltage VR(V): 100; Average rectified forward current IO(A): 0.5;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
High Sensitivity Chip Sensors Sideview Type; Type: Surface Mount Type; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±12; Dark current ICEO (Max.)(µA): 0.5; Response time tr·tf (µA): 10; Yes;
Reflective Type Photosensors (Photoreflectors); Type: Cased Type; Light Emitting Diode: 630; Phototransistor: 600; Collector current IC (Min.)(mA): 0.08; Response time tr·tf (µs): 10;
Photointerrupter General Type; Packing style: Plastic bag; Package quantity: 400; 塑料无引线芯片载
Plastic Leadless Chip Carrier 塑料无引线芯片载
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 80; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24; 塑料无引线芯片载
Lead Frame Remote Control Receiver Modules (5V Type); Packing style: Stick; Package quantity: 1000; 塑料无引线芯片载
660/780nm Dual Wave Low Power Lasers; Packing style: Tray; Package quantity: 500; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 400; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 5.5x6.5(t=2.3); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 6;
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| File Size |
127.83K /
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77313-422-00LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 02 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131934-220ULF
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| Description |
Minitek®, Board to Board, Receptacle, Through Mount, Single row, 20 Positions, 2mm (0.079inch), Vertical.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-422-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 06 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
380-5342-20W
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| Description |
Receptacle,INFINX,6 Pair 18 Position 12MM,100MΩ, w/lossy
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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