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  5634-9024 Datasheet PDF File

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    90325-9024

Molex Electronics Ltd.
Part No. 90325-9024
Description 1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 24 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 24 Circuits, Tin (Sn) Plating, Tube Packaging

File Size 119.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 69155-634LF
Description Quickie Slimline Header, Wire to Board connector, Through Hole, Right Angle, Double Row, 34 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    74320-9024

Molex Electronics Ltd.
Part No. 74320-9024
Description MicroCross DVI-I Digital Interface, PCB Receptacle, Panel Mount, Through Hole,Right Angle, ATX with Beveled Metal Pins, Gold (Au) Flash,with 4.75mm (.187) Jack

File Size 184.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-156-34LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Gennum Corporation
Part No. EB9024
Description GENLINX-TM II EB9024 Evaluation Board

File Size 116.54K  /  9 Page

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Amphenol Communications Solutions

Part No. 51915-634LF
Description PwrBlade®, Power Supply Connectors, 6ACP 24S Right Angle, Solder To Board Receptacle
Tech specs    

Official Product Page

    GENNUM[Gennum Corporation]
Part No. EB9024
Description GENLINX-TM II EB9024 Evaluation Board

File Size 113.20K  /  9 Page

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Amphenol Communications Solutions

Part No. 90309-024LF
Description Minitek® 2.00mm, Wire To Board, Shrouded Header, Vertical, Through Hole, Double Row, 24 Positions
Tech specs    

Official Product Page

    FR9024

International Rectifier
Part No. FR9024
Description Search --To IRFR9024

File Size 207.19K  /  6 Page

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Amphenol Communications Solutions

Part No. 10073599-024LF
Description Active Latch Housing, Double Row, 24 Positions, 2.00mm (0.079in) Pitch
Tech specs    

Official Product Page

    SA9024

NXP Semiconductors
Part No. SA9024
Description 900 MHz transmit modulator and 1.3 GHz fractional-N synthesizer

File Size 143.68K  /  23 Page

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Amphenol Communications Solutions

Part No. 10131319-024110PLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 30u\\ Gold on Contact area (100u\\ Matte Tin on Tails) plating, Natural Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    TE Connectivity Ltd
Part No. 519024-2
Description ECR-15-006103

File Size 94.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 67289-024LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 48 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs    

Official Product Page

    Dialog Semiconductor
Part No. DA9024
Description    DA9024 Quad 1.2A Buck PMIC with Audio Drivers

File Size 975.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-890-24LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
Tech specs    

Official Product Page

   
Part No. 6-390241-1
Description 184 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SOLDER, SOCKET

File Size 193.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 67289-024
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 48 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs    

Official Product Page

    SA9024

PHILIPS[Philips Semiconductors]
Part No. SA9024
Description 900 MHz transmit modulator and 1.3 GHz fractional-N synthesizer

File Size 139.13K  /  23 Page

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Amphenol Communications Solutions

Part No. 10127819-02421PLF
Description Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 30u\\ Gold plating, Black Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs    

Official Product Page

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