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Amphenol Communications Solutions |
| Part No. |
68016-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87916-418HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6418-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87606-418LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 36 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0447641803 44764-1803
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| Description |
3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Right Angle, with Press-fit Plastic Pegs, 0.8μm (30μ) Gold (Au) Selective, 18 Circuits
3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Right Angle, with Press-fit Plastic Pegs, 0.8μm (30μ) Gold (Au) Selective, 18 Circuits
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| File Size |
244.16K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68466-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
146-4182-12D
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| Description |
Paladin HD, RAF, 4 Pair, 8 Column, NiS
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91276-418HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67996-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6418-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6418-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 6401J |
| Maker: NAIS |
| Pack: QFN |
| Stock: 531 |
| Unit price
for : |
|
50: $2.95 |
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100: $2.81 |
| 1000:
$2.66 |
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Email: oulindz@gmail.com |
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