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  87759-2450 Datasheet PDF File

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    87759-3274

Molex Electronics Ltd.
Part No. 87759-3274
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 10132450-0611GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-3215

Molex Electronics Ltd.
Part No. 87759-3215
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.40K  /  6 Page

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Amphenol Communications Solutions

Part No. 54112-812262450LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4875

Molex Electronics Ltd.
Part No. 87759-4875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 61083-124506LF
Description BERGSTAK 0.8MM
Tech specs    

Official Product Page

    87759-4815

Molex Electronics Ltd.
Part No. 87759-4815
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.40K  /  6 Page

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Amphenol Communications Solutions

Part No. 66245-020LF
Description Quickie® IDC Cable-to-Board Connector System, Backplane - Double row - 20 Positions - 2.54 mm (0.100in) .
Tech specs    

Official Product Page

    87759-1015

Molex Electronics Ltd.
Part No. 87759-1015
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 68482-450HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4215

Molex Electronics Ltd.
Part No. 87759-4215
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.39K  /  6 Page

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Amphenol Communications Solutions

Part No. 10132450-2421GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 24 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    87759-3864

Molex Electronics Ltd.
Part No. 87759-3864
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

File Size 420.91K  /  8 Page

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Amphenol Communications Solutions

Part No. 10132450-1021GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 10 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    87759-4465

Molex Electronics Ltd.
Part No. 87759-4465
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 10132450-0621GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    87759-4076

Molex Electronics Ltd.
Part No. 87759-4076
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.72K  /  6 Page

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Amphenol Communications Solutions

Part No. 68692-450H
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-3014

Molex Electronics Ltd.
Part No. 87759-3014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.16K  /  8 Page

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Amphenol Communications Solutions

Part No. 77312-450LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single row , Duplex, Polarized, 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 87759-2450 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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