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bga-357 Datasheet PDF File

For bga-357 Found Datasheets File :: 31 Search Time::1.344ms
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					GSI[GSI Technology]
Part No.	GS8150V18AB-300 GS8150V18AB-300I GS8150V18AB-333 GS8150V18AB-333I GS8150V18AB-357 GS8150V18AB-357I GS8150V36AGB-357I GS8150V18AB GS8150V18AB-250 GS8150V18AB-250I GS8150V18AGB-250 GS8150V18AGB-250I GS8150V18AGB-300 GS8150V18AGB-300I GS8150V18AGB-333 GS8150V18AGB-333I GS8150V18AGB-357 GS8150V18AGB-357I GS8150V36AB-250 GS8150V36AB-250I GS8150V36AB-300 GS8150V36AB-300I GS8150V36AB-333 GS8150V36AB-333I GS8150V36AB-357 GS8150V36AB-357I GS8150V36AGB-250 GS8150V36AGB-250I GS8150V36AGB-300 GS8150V36AGB-300I GS8150V36AGB-333 GS8150V36AGB-333I GS8150V36AGB-357
OCR Text	BGA Commercial Temp Industrial Temp Features * Register-Register Late Write mode, Pipelined Read mode * 1.8 V +150/-100 mV core power suppl...357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O Because GS8150V18/36A are synchronous devices, address ...
Description	1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM
File Size	613.85K / 25 Page	View it Online	Download Datasheet

					FREESCALE[Freescale Semiconductor, Inc]
Part No.	MPC860 MPC860DE MPC860DP MPC860DT MPC855T MPC860DTZQ50D4 KMPC860DTZQ50D4 MPC860DTZQ66D4 MPC860DTZQ80D4 KMPC860DTZQ80D4 KMPC855TZQ50D4 KMPC855TZQ66D4 KMPC855TZQ80D4 KMPC860DEZQ50D4 KMPC860DEZQ80D4 KMPC860DPZQ80D4 KMPC860ENZQ66D4 KMPC860ENZQ80D4 KMPC860PZQ66D4 KMPC860PZQ80D4 KMPC860SRZQ50D4 KMPC860SRZQ66D4 MPC860PZQ50D4 MPC860PZQ66D4 MPC860PZQ66D4R2 MPC860PZQ80D4 MPC860PZQ80D4R2 KMPC860SRZQ80D4 KMPC860TZQ50D4 KMPC860TZQ66D4 KMPC860TZQ80D4 MPC860ENZQ50D4 MPC860ENZQ50D4R2 MPC860ENZQ66D4 MPC860ENZQ80D4 MPC860TCZQ66D4 MPC855TZQ50D4 MPC860DEZQ50D4 MPC860SRZQ50D4 MPC860TZQ50D4 MPC860DPZQ50D4 MPC855TCZQ50D4 MPC860DECZQ50D4 MPC860DTCZQ50D4 MPC860ENCZQ50D4 MPC860SRCZQ50D4 MPC860DPCZQ50D4 MPC860PCZQ66D4 MPC855TZQ66D4 MPC860DEZQ66D4 MPC860SRZQ66D4 MPC860TZQ66D4 MPC860DPZQ66D4 MPC855TCZQ66D4 MPC860ENCZQ66D4 MPC860SRCZQ66D4 MPC860DPZQ50D4R2 MPC860P
OCR Text	...EXTCLK 357-pin ball grid array (BGA) package 3 Maximum Tolerated Ratings This section provides the maximum tolerated voltage and temperature ranges for the MPC860. Table 2 provides the maximum ratings. This device contains circuitr...
Description	Hardware Specifications
File Size	1,009.25K / 80 Page	View it Online	Download Datasheet

					MOTOROLA[Motorola, Inc]
Part No.	MPC859TTSD MPC859DSL MPC859P MPC859T MPC859TTS
OCR Text	...bility 357-pin ball grid array (BGA) package -- -- -- -- -- -- -- -- MOTOROLA MPC859P/859T/859DSL PowerQUICCTM Family Technical Summary For More Information On This Product, Go to: www.freescale.com 5 Freescale Semiconductor,...
Description	PowerQUICC⑩ Family Technical Summary
File Size	272.11K / 12 Page	View it Online	Download Datasheet

					Freescale Semiconductor, Inc
Part No.	MPC860EC
OCR Text	...EXTCLK 357-pin ball grid array (BGA) package MPC860 PowerQUICCTM Family Hardware Specifications, Rev. 8 6 Freescale Semiconductor Maximum Tolerated Ratings 3 Maximum Tolerated Ratings This section provides the maximum tolerat...
Description	PowerQUICC⑩ Family Hardware Specifications
File Size	924.84K / 80 Page	View it Online	Download Datasheet

					Freescale Semiconductor, Inc Freescale Semiconductor...
Part No.	MPC860DEZQ50D4R2 MPC855TCZQ50D4R2 MPC855TZQ50D4R2 MPC860DEZQ80D4 MPC860PCZQ50D4 MPC860T MPC860TCZQ50D4 MPC860SR MPC855TZQ80D4 MPC860DPCZQ66D4 MPC860TZQ50D4R2 MPC860TZQ80D4 MPC860SRZQ50D4R2 MPC860SRZQ66D4 MPC860SRZQ80D4 KMPC860DTZQ80D4 KMPC860DPZQ80D4 KMPC860SRZQ80D4
OCR Text	...EXTCLK 357-pin ball grid array (BGA) package 3 Maximum Tolerated Ratings This section provides the maximum tolerated voltage and temperature ranges for the MPC860. Table 2 provides the maximum ratings. This device contains circuitr...
Description	Hardware Specifications Hardware Specifications
File Size	1,024.93K / 80 Page	View it Online	Download Datasheet

					Freescale Semiconductor, Inc Freescale Semiconductor...
Part No.	MPC860T KMPC855TZQ66D4 KMPC860ENZQ66D4 KMPC860PZQ66D4 KMPC860SRZQ66D4 KMPC860TZQ66D4 MPC855TCZQ66D4 MPC855TZQ66D4 KMPC860DTZQ50D4 MPC860DTZQ50D4 MPC860DTZQ66D4 KMPC860DEZQ50D4 MPC860DEZQ50D4 MPC860DEZQ50D4R2 MPC860DEZQ66D4 KMPC860DEZQ80D4 MPC860DEZQ80D4 KMPC855TZQ50D4 KMPC855TZQ80D4 KMPC860DPZQ80D4 KMPC860DTZQ80D4 KMPC860ENZQ80D4 MPC860PCZQ50D4 MPC860PCZQ66D4 MPC860EC MPC860DPZQ50D4 MPC860TCZQ50D4 MPC860SRCZQ50D4 MPC855TCZQ50D4R2 MPC860DECZQ50D4 MPC855TZQ50D4R2 MPC860DPCZQ66D4 MPC860DPCZQ50D4 MPC860DPZQ50D4R2 MPC860DTCZQ50D4 MPC860PZQ50D4 MPC860PZQ80D4R2 KMPC860PZQ80D4 MPC860PZQ66D4R2 KMPC860TZQ50D4 MPC860TZQ50D4R2 KMPC860TZQ80D4 MPC860DPZQ66D4 MPC860TCZQ66D4 MPC860ENZQ50D4R2 MPC860SRZQ50D4 MPC860SRZQ50D4R2 MPC860SRZQ66D4R2 MPC860SRZQ80D4 KMPC860SRZQ80D4
OCR Text	...EXTCLK 357-pin ball grid array (BGA) package MPC860 PowerQUICCTM Family Hardware Specifications, Rev. 8 6 Freescale Semiconductor Maximum Tolerated Ratings 3 Maximum Tolerated Ratings This section provides the maximum tolera...
Description	PowerQUICC Family Hardware Specifications PowerQUICC?/a> Family Hardware Specifications PowerQUICC?Family Hardware Specifications
File Size	938.95K / 80 Page	View it Online	Download Datasheet

					Tyco Electronics
Part No.	5-1542000-6
OCR Text	...FICATION OF MAXIMUM LOAD ON THE BGA PACKAGE. HEATSINK TORQUE SPECIFICATIONS CONVERTED TO FORCE. C BARE DIE PACKAGE: 1.5 INCH - LB TORQ...357 .245.005 5/8" - 27 UNS-2A THREAD SECTION B-B B A .115.005 B .987 LIP LEG 1.069 DO NOT S...
Description	Heat Sink Assemblies; HTS191-P=25MM HS ASSY PPA CLIP ( AMP )
File Size	16.96K / 1 Page	View it Online	Download Datasheet

					Tyco Electronics
Part No.	1542003-3
OCR Text	...FICATION OF MAXIMUM LOAD ON THE BGA PACKAGE. HEATSINK TORQUE SPECIFICATIONS CONVERTED TO FORCE. BARE DIE PACKAGE: 2.0 POUND-FORCE INCH TORQU...357 .108.005 B 1.384 LIP LEG 1.474 Power 5 Watts 10 Watts 15 Watts 1 - 27 UNS - 2A THREAD ...
Description	Heat Sink Assemblies; HTS501-U=35MM HS ASSY ULTEM CL ( Tyco Electronics )
File Size	22.32K / 1 Page	View it Online	Download Datasheet

					Tyco Electronics
Part No.	4-1542007-5
OCR Text	...FICATION OF MAXIMUM LOAD ON THE BGA PACKAGE. HEATSINK TORQUE SPECIFICATIONS CONVERTED TO FORCE. BARE DIE PACKAGE: 1.5 POUND-FORCE INCH TORQU...357 1 - 27 UNS-2B THREAD SECTION B-B C/W @ C/W @ C/W @ C/W @ Ambient 200 LFM 400 LFM 600 LFM 12...
Description	Heat Sink Assemblies; 35MM HS ASS'Y ULTEM CLIP ( Tyco Electronics )
File Size	23.32K / 1 Page	View it Online	Download Datasheet

					Fujitsu Component Limited. http://
Part No.	MB93461BGL-GE1 MB93461-40BGL-GE1 MB93461PB-GE1 MB93461-40PB-GE1
OCR Text	... PACKAGES 420-ball plastic BGA 400-ball plastic PFBGA (BGA-420P-M25) (BGA-400P-M04) MB93461 FEATURES FR450 CPU Core * 2-wa...357 10 109 200 283 358 11 110 201 284 359 12 111 202 285 360 13 112 203 286 361 14 113 204 287 362 1...
Description	FR450 Series VLIW Embedded Microprocessor
File Size	279.90K / 68 Page	View it Online	Download Datasheet

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