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MCR10 MB90595G M38C87MD 5820SMJ SHM100 PSWT7008 MAX3082E B27101G
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  dispensing Datasheet PDF File

For dispensing Found Datasheets File :: 288    Search Time::1.078ms    
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    MOMENTIVE
Part No. RTV167 RTV160
OCR Text ...? in.) or less. packaging and dispensing rtv160, rtv162, rtv167 adhesive sealants are suppli ed in caulking cartridges and bulk containers. rtv162 and rtv167 a re also available in collapsible squeeze tubes. tubes may be squeezed by ...
Description (RTV160 - RTV167) Electronic Grade Silicone Adhesive Sealants

File Size 78.34K  /  4 Page

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    LS03-05B05S LS03-05B09S LS03-05B03S LS03-05B15S LS03-05B24S LS03-05B12S

MORNSUN Science& Technology Ltd.
MORNSUN Science& Techno...
Part No. LS03-05B05S LS03-05B09S LS03-05B03S LS03-05B15S LS03-05B24S LS03-05B12S
OCR Text ...standards. 5. module required dispensing fixed after assembled. emc specifications emi ce cispr22/en55022 class b (recommended circuit refer to figure 3) re cispr22/en55022 class b (recommended circuit refer to figure 3) ems ...
Description 3W, AC-DC (High Voltage DC-DC) CONVERTER

File Size 882.68K  /  5 Page

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    CGY2013G CGY2013GC1

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. CGY2013G CGY2013GC1
OCR Text ...stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical re...
Description GSM 4 W power amplifier

File Size 86.11K  /  12 Page

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    C & K COMPONENTS INC
ITT CANNON
Part No. SD04H0K SD02H0B
OCR Text ...upplied in ?f?psition in rigid dispensing tubes or tape and reel packaging. specifications switch function: spst - 2, 3, 4, 5, 6, 7, 8, 9, 10 & 12 positions contact rating: carry: 100 ma @ 50 v dc max. switch: 0.1 ma @ 5 v dc min to 100...
Description SLIDE DIP SWITCH-4SWITCHES, SPST, LATCHED,0.1A, 25VDC, THROUGH HOLE-STRAIGHT
SLIDE DIP SWITCH-2SWITCHES, SPST, LATCHED,0.1A, 25VDC, THROUGH HOLE-STRAIGHT

File Size 280.00K  /  3 Page

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    CGY2030M

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. CGY2030M
OCR Text ...stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical re...
Description DECT 500 mW power amplifier

File Size 93.24K  /  12 Page

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    CGY2032BTS

NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
Part No. CGY2032BTS
OCR Text ...stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 10...
Description DECT 500 mW power amplifier(DECT 500 mW 功率放大

File Size 61.06K  /  12 Page

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    CGY2032TS

NXP Semiconductors
Philips Semiconductors
Part No. CGY2032TS
OCR Text ...stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 10...
Description DECT 500 mW power amplifier

File Size 60.20K  /  12 Page

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    ASMT-MAK0-AGH00

AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
Part No. ASMT-MAK0-AGH00
OCR Text ... using a stencil, or by syringe dispensing. the solder paste should cover the pad with a smooth, even contour, without voids. voids in the deposited solder paste may be due to contamination or oxidation on the pc boar...
Description Surface Mounting SMT LED Indicator Components

File Size 115.45K  /  6 Page

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    List of Unclassifed Manufac...
Part No. 903-N
OCR Text ...ernational?s 700 system premier dispensing components are silicone and chloride free and designed to work with industry standard equipment. 700 series industrial syringes and needles ensure accuracy, repeatability and productivity. bulk pac...
Description 700 System Syringes

File Size 42.33K  /  1 Page

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    UBA1710M

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. UBA1710M
OCR Text ...stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical re...
Description Modulator for GaAs power amplifiers

File Size 58.92K  /  12 Page

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For dispensing Found Datasheets File :: 288    Search Time::1.078ms    
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