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For pads Found Datasheets File :: 14861 Search Time::1.563ms
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				Mimix Broadband
Part No.	XA1000-BD-EV1 XA1000-BD-000V XA1000-BD
OCR Text	...de Metallization: Gold All Bond pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.28 mg. Bond Pad #1 (RF In) B...
Description	DC-18.0 GHz GaAs MMIC 5-Bit Digital Attenuator
File Size	360.20K / 6 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1005-BD-EV1 XP1005-BD-000V XP1005-BD
OCR Text	...Metallization: Gold All DC Bond pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond pads are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002)....
Description	35.0-43.0 GHz GaAs MMIC Power Amplifier
File Size	278.07K / 7 Page	View it Online	Download Datasheet

				King blillion Electronics Co.,Ltd.
Part No.	HE84770
OCR Text	...utputs. ,1~5 LCD segments share pads with key scan out SCNO[19..0]. The key scan function of SGKY[43..24] 6 ~ 25 O these pins can be disabled by mask option clearing MO_LCDKEY to `0', then SGKY[43..24] function as LCD segment driver only. S...
Description	8-bit Micro-controller
File Size	483.05K / 30 Page	View it Online	Download Datasheet

				MIMIX BROADBAND INC
Part No.	XP1013-BD-EV1 XP1013-BD-000V XP1013-BD
OCR Text	...Metallization: Gold All DC Bond pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond pads are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002)....
Description	17000 MHz - 26000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER 17.0-26.0 GHz GaAs MMIC Power Amplifier
File Size	462.45K / 7 Page	View it Online	Download Datasheet

				King blillion Electronics Co.,Ltd.
Part No.	HE83R125
OCR Text	...t 17 is shared with LCD segment pads SEG[39..32]. The function of the pad can be selected individually by mask options MO_LIO17[7..0]. (`1' for LCD and `0' for I/O). B/ The output type of I/O pad can also be selected by mask option MO_17PP[...
Description	This chip is suitable for the applications that require higher performance
File Size	319.68K / 18 Page	View it Online	Download Datasheet

				King blillion Electronics Co.,Ltd.
Part No.	HE83R123
OCR Text	...t 17 is shared with LCD segment pads SEG[39..32]. The function of the pad can be selected individually by mask options MO_LIO17[7..0]. (`1' for LCD and `0' for I/O). B/ The output type of I/O pad can also be selected by mask option MO_17PP[...
Description	oscillator clocks. This chip is suitable for the applications that require higher performance
File Size	320.35K / 18 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1014-BD-EV1 XP1014-BD-000V XP1014-BD
OCR Text	...Metallization: Gold All DC Bond pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond pads are 0.120 x 0.200 (0.005 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002)....
Description	8.5-11.0 GHz GaAs MMIC Power Amplifier
File Size	132.54K / 5 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1015-BD-EV1 XP1015-BD-000V XP1015-BD
OCR Text	...Metallization: Gold All DC Bond pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond pads are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002)....
Description	43.5-46.5 GHz GaAs MMIC Power Amplifier
File Size	224.38K / 5 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1016-BD-EV1 XP1016-BD-000V XP1016-BD
OCR Text	...Metallization: Gold All DC Bond pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond pads are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002)....
Description	43.5-46.5 GHz GaAs MMIC Power Amplifier
File Size	293.93K / 5 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	PCF2105 PCF2105MU PCF2105MU_2
OCR Text	...ction system of the SCL and SDA pads does not use a diode connected to VDD. The chip contains a character generator and displays alphanumeric and kana characters. The PCF2105 interfaces to most microcontrollers via a 4 or 8-bit parallel bus...
Description	LCD controller/driver
File Size	288.87K / 48 Page	View it Online	Download Datasheet

For pads Found Datasheets File :: 14861 Search Time::1.563ms
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