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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMPA1759
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| OCR Text |
... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should not be subjected to more than 225C and reflow solder in the molten state for... |
| Description |
3.4V Korean PCS CDMA PA Module
Korean-PCS PowerEdge Power Amplifier Module
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| File Size |
536.06K /
8 Page |
 View
it Online |
Download Datasheet
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMPA5255
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| OCR Text |
... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no... |
| Description |
From old datasheet system
4.9-5.9 GHz WLAN Linear Power Amplifier Module
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| File Size |
779.24K /
7 Page |
View
it Online |
Download Datasheet |
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Raytheon
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| Part No. |
RTPA5250-130
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| OCR Text |
...nd be a consistent thickness. rework considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. the device should not be subjected to more than 225c and reflow solder in the molten state ... |
| Description |
3.3V UNII band power amplifier MMIC
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| File Size |
202.91K /
13 Page |
View
it Online |
Download Datasheet |
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Fairchild Semiconductor Corporation
FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMPA0963
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| OCR Text |
...nd be a consistent thickness. * rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should not be subjected to more than 225C and reflow solder in the molten state for... |
| Description |
Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module
From old datasheet system
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| File Size |
117.92K /
7 Page |
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it Online |
Download Datasheet |
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FAIRCHILD SEMICONDUCTOR CORP
FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMPA2263
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| OCR Text |
... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no... |
| Description |
WCDMA Power Amplifier Module 1920-1980 MHz
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| File Size |
108.75K /
7 Page |
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it Online |
Download Datasheet |
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMPA2266
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| OCR Text |
... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no... |
| Description |
WCDMA Band I Power Amplifier Module
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| File Size |
189.22K /
7 Page |
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it Online |
Download Datasheet |
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Price and Availability
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