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Amphenol Communications Solutions |
Part No. |
L717HDA26PVFM
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Pin, Flash Gold, Fixed M3 Front Screwlock, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L717HDC62PC309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
22-28-4026
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Description |
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, 2 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240) 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240)
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File Size |
522.40K /
36 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
L717HDE15PVF
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 15 Pin, Flash Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L717HDC62POL2C309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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