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  54775 Datasheet PDF File

For 54775 Found Datasheets File :: 35+       Page :: | 1 | 2 | <3> | 4 |   

    0015477554

Molex Electronics Ltd.
Part No. 0015477554
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, Tin (Sn) Plating

File Size 377.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 54775-602-30LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015477556

Molex Electronics Ltd.
Part No. 0015477556
Description MOLEX Connector

File Size 377.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 54775-602-36LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477558

Molex Electronics Ltd.
Part No. 0015477558
Description MOLEX Connector

File Size 377.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 54775-102-36LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477550

Molex Electronics Ltd.
Part No. 0015477550
Description MOLEX Connector

File Size 377.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 54775-102-30LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    15-47-7524 0015477524 A-70568-0010

Molex Electronics Ltd.
Part No. 15-47-7524 0015477524 A-70568-0010
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, Tin (Sn) Plating

File Size 377.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 54775-101-36LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    15-47-7528 0015477528 A-70568-0012

Molex Electronics Ltd.
Part No. 15-47-7528 0015477528 A-70568-0012
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, Tin (Sn) Plating

File Size 377.50K  /  4 Page

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    15-47-7520 0015477520 A-70568-0008

Molex Electronics Ltd.
Part No. 15-47-7520 0015477520 A-70568-0008
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, Tin (Sn) Plating

File Size 377.43K  /  4 Page

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    15-47-7516 0015477516 A-70568-0006

Molex Electronics Ltd.
Part No. 15-47-7516 0015477516 A-70568-0006
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, Tin (Sn) Plating

File Size 377.48K  /  4 Page

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    15-47-7514 0015477514 A-70568-0005

Molex Electronics Ltd.
Part No. 15-47-7514 0015477514 A-70568-0005
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating

File Size 377.43K  /  4 Page

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    15-47-7512 0015477512 A-70568-0004

Molex Electronics Ltd.
Part No. 15-47-7512 0015477512 A-70568-0004
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits

File Size 377.43K  /  4 Page

View it Online

Download Datasheet

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