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Amphenol Communications Solutions |
| Part No. |
66506-103LF
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| Description |
Quickie® IDC Cable-to-Board Connector System, Shrouded Slim Line Header, Vertical, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93689-106-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Press Fit, Single row , 10 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-106-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-45-1805 70475-0424 A-70475-0424
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| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 5 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 5 Circuits
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| File Size |
150.54K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54121-806100850LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10129206-1002201LF
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| Description |
DDR4 DIMM, Ultra Low Profile, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10129206-1000013LF
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| Description |
DDR4 DIMM, Ultra Low Profile, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-45-1806 A-70475-0425
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| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 6 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 6 Circuits
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| File Size |
141.48K /
2 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10129206-1012013LF
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| Description |
DDR4 DIMM, Ultra Low Profile, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
66506-103
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| Description |
Quickie® IDC Cable-to-Board Connector System, Shrouded Slim Line Header, Vertical, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-812061000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-45-1804 70475-0423 A-70475-0423
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| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 4 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 4 Circuits
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| File Size |
150.54K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
98414-S06-10ULF
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| Description |
Minitek® 2.00mm, Board to Board, Shrouded Vertical Header, Through Hole, Double Row, 10 Position ,2.00mm (0.079in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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