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Rochester Electronics LLC |
| Part No. |
8501002YC
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| Description |
8501002YC - Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68 - Dual marked (MQ80186-6/BYC)
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
8501001YA
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| Description |
80186 - High-Integration 16-Bit Microprocessor, CQFP68 (8501001YA)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
85013-3160
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| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 32 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 32 Circuits, Lead free
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| File Size |
124.34K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
91276-135HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-50LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-18LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501-08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68585-016LF
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| Description |
BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 40 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
85015-9004
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| Description |
2.54mm (.100) Pitch DIN 41612 Header, 4-Row, Style R, Through Hole, Press-fit, Male, 0.6渭m (24渭) Selective Gold (Au), First-Mate-Last-BreakPins, 128 Circuits
2.54mm (.100) Pitch DIN 41612 Header, 4-Row, Style R, Through Hole, Press-fit, Male, 0.6μm (24μ) Selective Gold (Au), First-Mate-Last-BreakPins, 128 Circuits
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| File Size |
141.56K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95278-501A08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501A30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
85015-9008
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| Description |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 0.6渭m (24渭) Selective Gold (Au), 128 Circuits, Lead Free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 0.6μm (24μ) Selective Gold (Au), 128 Circuits, Lead Free
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| File Size |
167.63K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95278-501B12LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Price and Availability
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