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Amphenol Communications Solutions |
Part No. |
10125112-080012CLF
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Description |
HPCE BTB R/A Receptacle 8P12S WITH GUIDE
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-80-0129 0015800129 A-70567-0276
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla Molex Electronics Ltd.
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File Size |
1,218.57K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10125023-080012ALF
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Description |
HPCE BTB VT RECEPT 8P12S
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-80-0125 0015800125 70567-0140
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla Molex Electronics Ltd.
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File Size |
1,218.47K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68001-205HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 5 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68001-226HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 26 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10121506-080012CLF
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Description |
HPCE STD VT Receptacle 8P12S
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68001-225HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 25 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68001-232HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 32 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10122237-480012ALF
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Description |
HPCE-STD STRADDLE MOUNT 48P12S
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-80-0121 A-70567-0004 0015800121 705670004
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68001-200HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 1 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68001-204
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 4 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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