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  87759-2450 Datasheet PDF File

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    87759-4015

Molex Electronics Ltd.
Part No. 87759-4015
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 383.21K  /  9 Page

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Amphenol Communications Solutions

Part No. 10132450-0611GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-4014

Molex Electronics Ltd.
Part No. 87759-4014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 563.47K  /  11 Page

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Amphenol Communications Solutions

Part No. 54112-812262450LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-3214

Molex Electronics Ltd.
Part No. 87759-3214
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.10K  /  8 Page

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Amphenol Communications Solutions

Part No. 61083-124506LF
Description BERGSTAK 0.8MM
Tech specs    

Official Product Page

    87759-1615

Molex Electronics Ltd.
Part No. 87759-1615
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 66245-020LF
Description Quickie® IDC Cable-to-Board Connector System, Backplane - Double row - 20 Positions - 2.54 mm (0.100in) .
Tech specs    

Official Product Page

    87759-3875

Molex Electronics Ltd.
Part No. 87759-3875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs,

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 68482-450HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-2474

Molex Electronics Ltd.
Part No. 87759-2474
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 10132450-2421GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 24 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    87759-1014

Molex Electronics Ltd.
Part No. 87759-1014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.16K  /  8 Page

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Amphenol Communications Solutions

Part No. 10132450-1021GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 10 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    87759-1474

Molex Electronics Ltd.
Part No. 87759-1474
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 421.28K  /  8 Page

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Amphenol Communications Solutions

Part No. 10132450-0621GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    87759-1476

Molex Electronics Ltd.
Part No. 87759-1476
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.83K  /  6 Page

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Amphenol Communications Solutions

Part No. 68692-450H
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1475

Molex Electronics Ltd.
Part No. 87759-1475
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.41K  /  6 Page

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Amphenol Communications Solutions

Part No. 77312-450LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single row , Duplex, Polarized, 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 87759-2450 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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