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  87834-0819 Datasheet PDF File

For 87834-0819 Found Datasheets File :: 133+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

    87834-2645

Molex Electronics Ltd.
Part No. 87834-2645
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 26 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.68K  /  3 Page

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Analog Devices

Part No. 108190-HMC591LP5
Description HMC591LP5 Evaluation PCB
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-2695

Molex Electronics Ltd.
Part No. 87834-2695
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.34K  /  3 Page

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Analog Devices

Part No. 108190-HMC487LP5
Description HMC487LP5 Evaluation PCB
Tech specs    

Official Product Page

    87834-2419

Molex Electronics Ltd.
Part No. 87834-2419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 24 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Renesas Electronics Corporation

Part No. RJK0819DSP-00#J0
Description Nch Dual Power Mosfet 80V 2.4A 175Mohm Sop8
Tech specs    

Official Product Page

    87834-4143

Molex Electronics Ltd.
Part No. 87834-4143
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without PCB Locator

File Size 93.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-809081900LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 8 Positions
Tech specs    

Official Product Page

    87834-2411

Molex Electronics Ltd.
Part No. 87834-2411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 24 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-811081900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-4095

Molex Electronics Ltd.
Part No. 87834-4095
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.34K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-112081950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87834-4092

Molex Electronics Ltd.
Part No. 87834-4092
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows

File Size 100.59K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-F08-19LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    87834-4045

Molex Electronics Ltd.
Part No. 87834-4045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-S08-19LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions
Tech specs    

Official Product Page

    87834-4093

Molex Electronics Ltd.
Part No. 87834-4093
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.76μm (30μ) Gold (Au) Plating, End Windows

File Size 100.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 54202-T0819LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 38 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-1641

Molex Electronics Ltd.
Part No. 87834-1641
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-112081950RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 87834-0819 Found Datasheets File :: 133+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

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