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DATA_IMAGE
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Part No. |
TG161600FFEBBT1
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OCR Text |
...gth :1.5N/cm (peeling upward by 90deg. Speed:50mm/min) 7.5 Flexible Pattern Bending Resistance Bending: 3 times or more by bending radius R1.0mm. 7.6 Flexible Pattern insert/pull out Resistance 5 times at least. The requirements in 5.1 shal... |
Description |
Single TAB/COG Graphic Module
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File Size |
547.88K /
22 Page |
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DATA_IMAGE
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Part No. |
TG322411FFSWBT1
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OCR Text |
...gth :1.5N/cm (peeling upward by 90deg. Speed:50mm/min) 7.5 Flexible Pattern Bending Resistance Bending: 3 times or more by bending radius R1.0mm. 7.6 Flexible Pattern insert/pull out Resistance 5 times at least. The requirements in 5.1 shal... |
Description |
Single TAB/COG Graphic Module
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File Size |
504.96K /
24 Page |
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it Online |
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FUJI ELECTRIC HOLDINGS CO., LTD.
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Part No. |
YG962S6R
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OCR Text |
...ck : 5N Number of times :2times(90deg./time) Screwing torque value: (M3) TO-220,TO-220F : 4010N TO-3P,TO-3PF,TO-247 : 5010N TO-3PL : 7010N frequency : 100Hz to 2kHz 2 Acceleration : 100m/s Sweeping time : 4min./1 cycle 4times for each X,Y&Z... |
Description |
SILICON DIODE IC, FLASH, X8, 64MBIT, 8MB, 3V, TSOP
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File Size |
136.40K /
12 Page |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
PS21352-N
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OCR Text |
...w : M3 Weight 9.8N Weight 4.9N. 90deg bend (Note 6) -- EIAJ-ED-4701 EIAJ-ED-4701 -- -- Min. 0.59 10 2 -- -50 Limits Typ. 0.78 -- -- 20 -- Max. 0.98 -- -- -- 100 Unit N*m s times g m
Note 6: Measurement point of heat-sink flatness
DIP-IP... |
Description |
TRANSFER-MOLD TYPE INSULATED TYPE
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File Size |
170.91K /
9 Page |
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it Online |
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Price and Availability
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