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For bondable Found Datasheets File :: 291    Search Time::6.671ms    
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    State of the Art, Inc.
Part No. M55342M12G2P70S-TR
OCR Text ... solderable wraparound c: epoxy bondable palladium/silver wraparound u: epoxy bondable platinum/gold wraparound w: gold wire bondable g: gold wraparound termination materials: b: solderable wraparound c: epoxy bondable palladium/silver wrap...
Description RESISTOR, METAL GLAZE/THICK FILM, 0.1 W, 10 %, 300 ppm, 2700000 ohm, SURFACE MOUNT, 0603 CHIP

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    State of the Art, Inc.
Part No. S0303CA9R09FEW S0303AA9R09FEW
OCR Text ...g). available options are epoxy bondable and wire bondable terminations, and custom part marking. sota offers a full line of component parts in the 0303 size including high-reliability (customer specified testing). available options are epo...
Description RESISTOR, THIN FILM, 0.05 W, 1 %, 25 ppm, 9.09 ohm, SURFACE MOUNT, 0303 CHIP

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    State of the Art, Inc.
Part No. M55342M09G2P70S-TR M55342K09G2P70S-TR
OCR Text ... solderable wraparound c: epoxy bondable palladium/silver wraparound u: epoxy bondable platinum/gold wraparound w: gold wire bondable g: gold wraparound termination materials: b: solderable wraparound c: epoxy bondable palladium/silver wrap...
Description RESISTOR, METAL GLAZE/THICK FILM, 1 W, 10 %, 300 ppm, 2700000 ohm, SURFACE MOUNT, 2512 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 10 %, 100 ppm, 2700000 ohm, SURFACE MOUNT, 2512 CHIP

File Size 94.97K  /  1 Page

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    RHOPOINT[RHOPOINT COMPONENTS]
Part No. CHR CHR2520FC-10MEG-1 CHR2520FC
OCR Text ...rednon-standardC.002* Gold Wire bondable Versions Meg ppm/C) Type N/A tolerancesCHR(12.70 .76) (2.39 .38) (.64 .05)* Precision Optimized Tolerance and TC high 10 Meg N/A ** Higher TC (such as Caddock can be manufacturednon-standard * Offset...
Description 10 MEG TO 100 MEG, 1 TOLERANCE, TEMPERATURE COEFFICIENT TO AS LOW AS 25 PPM/C

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    State of the Art, Inc.
Part No. M55342K10G2P70S-TR M55342M10G2P70S-TR
OCR Text ... solderable wraparound c: epoxy bondable palladium/silver wraparound u: epoxy bondable platinum/gold wraparound w: gold wire bondable g: gold wraparound termination materials: b: solderable wraparound c: epoxy bondable palladium/silver wrap...
Description RESISTOR, METAL GLAZE/THICK FILM, 0.5 W, 10 %, 100 ppm, 2700000 ohm, SURFACE MOUNT, 1010 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.5 W, 10 %, 300 ppm, 2700000 ohm, SURFACE MOUNT, 1010 CHIP

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    State of the Art, Inc.
Part No. M55342K06G2P70S-TR M55342M06G2P70S-TR M55342K06G2P70S-W M55342M06G2P70S-W
OCR Text ... solderable wraparound c: epoxy bondable palladium/silver wraparound u: epoxy bondable platinum/gold wraparound w: gold wire bondable g: gold wraparound termination materials: b: solderable wraparound c: epoxy bondable palladium/silver wrap...
Description RESISTOR, METAL GLAZE/THICK FILM, 0.15 W, 10 %, 100 ppm, 2700000 ohm, SURFACE MOUNT, 0705 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.15 W, 10 %, 300 ppm, 2700000 ohm, SURFACE MOUNT, 0705 CHIP

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    State of the Art, Inc.
Part No. M55342K05G2P70STR M55342M05G2P70STR
OCR Text ... solderable wraparound c: epoxy bondable palladium/silver wraparound u: epoxy bondable platinum/gold wraparound w: gold wire bondable g: gold wraparound termination materials: b: solderable wraparound c: epoxy bondable palladium/silver wrap...
Description RESISTOR, METAL GLAZE/THICK FILM, 0.225 W, 10 %, 100 ppm, 2700000 ohm, SURFACE MOUNT, 2208 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.225 W, 10 %, 300 ppm, 2700000 ohm, SURFACE MOUNT, 2208 CHIP

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    State of the Art, Inc.
Part No. S1505CPX1R43F30 S1505CPX2R43F30
OCR Text ...rable) c: silver bearing (epoxy bondable-rohs) g: gold (epoxy bondable-rohs) y: silver over nickel (solderable -rohs) z: gold over nickel (solderable-rohs) termination finish: x: sn60 over nickel (solderable) c: silver bearing (epoxy bondab...
Description RESISTOR, METAL GLAZE/THICK FILM, 0.33 W, 1 %, 300 ppm, 1.43 ohm, SURFACE MOUNT, 1505 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.33 W, 1 %, 300 ppm, 2.43 ohm, SURFACE MOUNT, 1505 CHIP

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    State of the Art, Inc.
Part No. S1206CPX1R43F20-TR S1206CPX2R43F10-TR S1206CPX2R43F30-TR S1206CPX430G20-TR S1206CPX430G10-TR S1206CPX430J10 S1206CPX1R43F10-TR S1206CPX1R43F30-TR S1206CPX430G30-TR S1206CPX2R43F20-TR
OCR Text ...rable) c: silver bearing (epoxy bondable-rohs) g: gold (epoxy bondable-rohs) y: silver over nickel (solderable -rohs) z: gold over nickel (solderable-rohs) termination finish: x: sn60 over nickel (solderable) c: silver bearing (epoxy bondab...
Description RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 1 %, 200 ppm, 1.43 ohm, SURFACE MOUNT, 1206 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 1 %, 100 ppm, 2.43 ohm, SURFACE MOUNT, 1206 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 1 %, 300 ppm, 2.43 ohm, SURFACE MOUNT, 1206 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 2 %, 200 ppm, 43 ohm, SURFACE MOUNT, 1206 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 2 %, 100 ppm, 43 ohm, SURFACE MOUNT, 1206 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 5 %, 100 ppm, 43 ohm, SURFACE MOUNT, 1206 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 1 %, 100 ppm, 1.43 ohm, SURFACE MOUNT, 1206 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 1 %, 300 ppm, 1.43 ohm, SURFACE MOUNT, 1206 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 2 %, 300 ppm, 43 ohm, SURFACE MOUNT, 1206 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.25 W, 1 %, 200 ppm, 2.43 ohm, SURFACE MOUNT, 1206 CHIP

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    Stackpole Electronics, Inc.
Part No. HVCB2512T03G005I HVCB2512T03G005A HVCS2512T08G205A HVCU2512T08G205A HVCG2512T08G205A
OCR Text ... ppm/volt ? available with wire bondable terminations ? very low noise ? tight tolerances to 0.1% ? ultra high stability ? utilizes fine film resistor deposition technology ? custom sizes available ? superior pulse handling capabilities ? r...
Description RESISTOR, 2 W, 5 %, 200 ppm, 3000000000 ohm, SURFACE MOUNT, 2512 CHIP, ROHS COMPLIANT
RESISTOR, 2 W, 5 %, 200 ppm, 8200000000 ohm, SURFACE MOUNT, 2512 CHIP, ROHS COMPLIANT

File Size 177.44K  /  2 Page

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For bondable Found Datasheets File :: 291    Search Time::6.671ms    
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