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mcp pop Datasheet PDF File

For mcp pop Found Datasheets File :: 32 Search Time::1.094ms
Page :: | 1 | 2 | <3> | 4 |

					Spansion Inc. Spansion, Inc.
Part No.	S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS256NDGBFWLJ0 S75WS256NDGBFWLJ2 S75WS256NDGBFWLH3 S75WS256NDFBAWLH0 S75WS256NDFBAWLJ0 S75WS256NDFBAWLJ2 S75WS256NDFBAWLH3 S75WS256NDFBAWLH2 S75WS256NDFBFWLH3 S75WS256NDGBAWSJ3 S75WS256NDGBFWLJ3 S75WS256NDGBAWSH3
OCR Text	mcp products s73ws-p based mcp products cover sheet 1.8 volt-only x16 simultaneous read/write, burst mode flash mobile sdram on shared bus ...pop fbga, pb-free jf = 1.4mm mcp fbga, pb-free dram & ornand flash density d0 = 128 mb dram, no data...
Description	Stacked Multi-Chip Product (mcp) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (mcp) 堆叠式多芯片产品（mcp
File Size	112.33K / 10 Page	View it Online	Download Datasheet

					SPANSION
Part No.	S73WS512P
OCR Text	mcp products s73ws-p based mcp products cover sheet 1.8 volt-only x16 simultaneous read/write, burst mode flash mobile sdram on shared bus ...pop fbga, pb-free jf = 1.4mm mcp fbga, pb-free dram & ornand flash density d0 = 128 mb dram, no data...
Description	Stacked Multi-Chip Product
File Size	135.43K / 10 Page	View it Online	Download Datasheet

					Hynix Semiconductor
Part No.	H5MS1G22MFP
OCR Text	...withtheadventofmultichippackage(mcp),packag eonpackage(pop)andsysteminapackage(sip)ap plications, customerdemandforknowngooddie(kgd)hasincrea sed. requirementsforsmallerformfactorsandhigherme morydensitiesarefuelingtheneedforwaferlevel memo...
Description	1Gbit MOBILE DDR SDRAM
File Size	2,515.79K / 63 Page	View it Online	Download Datasheet

					Hynix Semiconductor
Part No.	H5MS5162DFR-K3M H5MS5162DFR-E3M H5MS5162DFR-J3M H5MS5162DFR-L3M
OCR Text	...e advent of Multi-Chip package (mcp), Package on Package (pop) and System in a Package (SiP) applications, customer demand for Known Good Die (KGD) has increased. Requirements for smaller form factors and higher memory densities are fueling...
Description	512Mb (32Mx16bit) Mobile DDR SDRAM
File Size	1,323.43K / 62 Page	View it Online	Download Datasheet

					Hynix Semiconductor
Part No.	H5MS5122DFR H5MS5132DFR
OCR Text	...e advent of Multi-Chip package (mcp), Package on Package (pop) and System in a Package (SiP) applications, customer demand for Known Good Die (KGD) has increased. Requirements for smaller form factors and higher memory densities are fueling...
Description	Mobile DDR SDRAM 512Mbit (16M x 32bit)
File Size	2,296.94K / 62 Page	View it Online	Download Datasheet

					Hynix Semiconductor
Part No.	H5MS2562JFR-E3M H5MS2562JFR-J3M H5MS2562JFR-K3M H5MS2562JFR-L3M
OCR Text	...e advent of Multi-Chip package (mcp), Package on Package (pop) and System in a Package (SiP) applications, customer demand for Known Good Die (KGD) has increased. Requirements for smaller form factors and higher memory densities are fueling...
Description	256Mb (16Mx16bit) Mobile DDR SDRAM
File Size	1,318.70K / 62 Page	View it Online	Download Datasheet

					Hynix Semiconductor http://
Part No.	H5MS2622JFR H5MS2532JFR
OCR Text	...e advent of Multi-Chip package (mcp), Package on Package (pop) and System in a Package (SiP) applications, customer demand for Known Good Die (KGD) has increased. Requirements for smaller form factors and higher memory densities are fueling...
Description	256Mb (8Mx32bit) Mobile DDR SDRAM
File Size	1,545.91K / 63 Page	View it Online	Download Datasheet

					Hynix Semiconductor
Part No.	H5MS1G22MFP-L3M H5MS1G32MFP-L3M H5MS1G22MFP-E3M H5MS1G22MFP-J3M H5MS1G22MFP-K3M H5MS1G32MFP-E3M H5MS1G32MFP-J3M H5MS1G32MFP-K3M
OCR Text	...e advent of Multi-Chip package (mcp), Package on Package (pop) and System in a Package (SiP) applications, customer demand for Known Good Die (KGD) has increased. Requirements for smaller form factors and higher memory densities are fueling...
Description	1Gbit MOBILE DDR SDRAM based on 8M x 4Bank x32 I/O
File Size	2,451.55K / 63 Page	View it Online	Download Datasheet

					Hynix Semiconductor
Part No.	H5MS1262EFP-L3E H5MS1262EFP-L3M H5MS1262EFP-J3E H5MS1262EFP-J3M H5MS1262EFP-K3E H5MS1262EFP-K3M
OCR Text	...e advent of Multi-Chip package (mcp), Package on Package (pop) and System in a Package (SiP) applications, customer demand for Known Good Die (KGD) has increased. Requirements for smaller form factors and higher memory densities are fueling...
Description	128M (8Mx16bit) Mobile DDR SDRAM
File Size	1,319.94K / 62 Page	View it Online	Download Datasheet

					HYNIX SEMICONDUCTOR INC
Part No.	H5MS1222EFP-L3E H5MS1222EFP-L3M H5MS1222EFP-J3E H5MS1222EFP-J3M H5MS1222EFP-K3E H5MS1222EFP-K3M H5MS1222EFP-Q3E H5MS1222EFP-Q3M HYNIXSEMICONDUCTORINC-H5MS1222EFP-Q3E
OCR Text	...e advent of Multi-Chip package (mcp), Package on Package (pop) and System in a Package (SiP) applications, customer demand for Known Good Die (KGD) has increased. Requirements for smaller form factors and higher memory densities are fueling...
Description	128Mbit MOBILE DDR SDRAM based on 1M x 4Bank x32 I/O 4M X 32 DDR DRAM, PBGA90
File Size	1,786.62K / 62 Page	View it Online	Download Datasheet

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