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  placement Datasheet PDF File

For placement Found Datasheets File :: 13917    Search Time::1.219ms    
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Part No. 100X07N474MV4T
OCR Text ...educes component count ? lowers placement cost x2y ? circuit 2: decoupling when used in circuit 2 configuration, a & b capacitors are placed in parallel effectively doubling the apparent capacitance while maintaining an ultra-low inductan...
Description 1 FUNCTIONS, 10 V, DATA LINE FILTER

File Size 496.01K  /  6 Page

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    HSP061-2M6 HSP061-2N4 HSP061-2P6 HSP061-2

ST Microelectronics
STMicroelectronics
Part No. HSP061-2M6 HSP061-2N4 HSP061-2P6 HSP061-2
OCR Text ...to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 4. qfn 1.45x1.00 6l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.50 0.55 0.60 0.020 0.022 0.024 a1...
Description 2-line ESD protection for high speed lines

File Size 246.62K  /  12 Page

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    TGA1171-SCC

TriQuint Semiconductor
Part No. TGA1171-SCC
OCR Text ...trogen atmosphere. Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description 36 TO 40 GHZ 1W POWER AMPLIFIER

File Size 882.34K  /  9 Page

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    TGC1430H

TriQuint Semiconductor
Part No. TGC1430H
OCR Text ...itrogen atmosphere Component placement and adhesive attachment assembly notes: *= *= *= *= *= *= *= vacuum pencils and/or vacuum collets preferred method of pick up avoidance of air bridges during placement force impact critical during a...
Description 20 - 40 GHZ IQ MIXER

File Size 436.53K  /  3 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA9092 TGA9092-EPU
OCR Text ...itrogen atmosphere Component placement and adhesive attachment assembly notes: * * * * * * * vacuum pencils and/or vacuum collets preferred method of pick up avoidance of air bridges during placement force impact critical during auto pla...
Description 6 - 18 GHz High Power Amplifier

File Size 492.63K  /  4 Page

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    TGC1439A TGC1439A-EPU

TriQuint Semiconductor
Part No. TGC1439A TGC1439A-EPU
OCR Text ...itrogen atmosphere Component placement and adhesive attachment assembly notes: *= *= *= *= *= *= *= vacuum pencils and/or vacuum collets preferred method of pick up avoidance of air bridges during placement force impact critical during a...
Description 18 - 20 GHZ 5-BIT PHASE SHIFTER

File Size 924.64K  /  5 Page

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    Microchip Technology, Inc.
Part No. PIC18F97J60
OCR Text ...Note 1: 2: The ECCP2/P2A pin placement depends on the CCP2MX Configuration bit setting. P1B, P1C, P3B and P3C pin placement depends on the ECCPMX Configuration bit setting. (c) 2006 Microchip Technology Inc. Preliminary RC6/TX1/...
Description General Purpose PIC18 J-series Microcontroller providing 10 MIPS performance at 3V with 8MHz interna

File Size 4,015.12K  /  472 Page

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    PIC18FXXXX PIC18LF8722-E_PT PIC18F6627 PIC18F6722 PIC18F8627 PIC18F8722 PIC18LF6722-I_PT301

MICROCHIP[Microchip Technology]
Part No. PIC18FXXXX PIC18LF8722-E_PT PIC18F6627 PIC18F6722 PIC18F8627 PIC18F8722 PIC18LF6722-I_PT301
OCR Text ... Note 1: The CCP2/P2A pin placement is determined by the CCP2MX configuration bit and Processor mode settings. DS39646A-page 2 Advance Information RC0/T1OSO/T13CKI RC6/TX1/CK1 2004 Microchip Technology Inc. PIC18F66...
Description (PIC18Fxx2x) Enhanced Flash Microcontrollers
64/80-PIN 1-MBIT ENHANCED FLASH MICROCONTROLLERS WITH 10-BIT A/D AND NANOWATT TECHNOLOGY

File Size 4,206.17K  /  444 Page

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    TGA1172-SCC

TriQuint Semiconductor
Part No. TGA1172-SCC
OCR Text ...re. TGA1172-SCC Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description 27 - 32 GHZ 1W POWER AMPLIFIER

File Size 326.24K  /  8 Page

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