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Murata Manufacturing Co...
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Part No. |
NFM31KC103R1H3
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OCR Text |
...5. reflow soldering ? standard printing pattern of solder paste. 1) soldering paste printing for reflow ? standard thickness of solder paste: 100m to 150m. ? use the solder paste printing pattern of the right pattern. ? for the resist and ... |
Description |
This product specification is applied to Chip EMIFIL
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File Size |
499.31K /
10 Page |
View
it Online |
Download Datasheet
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Murata Manufacturing Co...
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Part No. |
NFM31HK223R1H3
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OCR Text |
...s for the products. ? standard printing pattern of solder paste. 8. reflow soldering 1) soldering paste printing for reflow ? standard thickness of solder paste: 100m to 150m. ? use the solder paste printing pattern of the right pattern. ?... |
Description |
This product specification is applied to Chip EMIFIL
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File Size |
500.70K /
11 Page |
View
it Online |
Download Datasheet
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Murata Manufacturing Co...
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Part No. |
NFM31HK104R1H3
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OCR Text |
...s for the products. ? standard printing pattern of solder paste. 8. reflow soldering 1) soldering paste printing for reflow ? standard thickness of solder paste: 100m to 150m. ? use the solder paste printing pattern of the right pattern. ?... |
Description |
This product specification is applied to Chip EMIFIL
|
File Size |
375.53K /
11 Page |
View
it Online |
Download Datasheet
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 |
Murata Manufacturing Co...
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Part No. |
NFM31HK103R2A3
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OCR Text |
...s for the products. ? standard printing pattern of solder paste. 8. reflow soldering 1) soldering paste printing for reflow ? standard thickness of solder paste: 100m to 150m. ? use the solder paste printing pattern of the right pattern. ?... |
Description |
This product specification is applied to Chip EMIFIL
|
File Size |
500.77K /
11 Page |
View
it Online |
Download Datasheet
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