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sn60 Datasheet PDF File

For sn60 Found Datasheets File :: 239 Search Time::1.406ms
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				HSMC CORP. Hi-Sincerity Mocroelectronics
Part No.	HIRF740 HIRF740F IRF740F
OCR Text	...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I J K L M N O P Min. 5.58 8.38 4.40 1.15 0.35 ...
Description	N-Channel Power MOSFET (400V, 10A)
File Size	46.93K / 4 Page	View it Online	Download Datasheet

				HSMC CORP. Hi-Sincerity Mocroelectronics
Part No.	HIRF830 HIRF830F
OCR Text	...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I J K L M N O P Min. 5.58 8.38 4.40 1.15 0.35 ...
Description	N-CHANNEL POWER MOSFET
File Size	45.41K / 4 Page	View it Online	Download Datasheet

				HSMC CORP. Hi-Sincerity Mocroelectronics Hi-Sincerity Microelectronics
Part No.	HIRF840 HIRF840F
OCR Text	...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I J K L M N O P Min. 5.58 8.38 4.40 1.15 0.35 ...
Description	N-Channel Power MOSFET
File Size	45.83K / 4 Page	View it Online	Download Datasheet

				Hi-Sincerity Mocroelectronics
Part No.	H07N65
OCR Text	...erial: ? lead solder plating: sn60/pb40 (normal), sn/3.0ag/0.5cu or pure-tin (pb-free) ? mold compound: epoxy resin family, flammability solid bu rning class: ul94v-0 3-lead to-220ab plastic package hsmc package code: e dim min....
Description	N-Channel Power Field Effect Transistor
File Size	119.76K / 6 Page	View it Online	Download Datasheet

				Hi-Sincerity Mocroelectronics
Part No.	HSBR101X0CT HSBR10100CT HSBR10150CT
OCR Text	...erial: ? lead solder plating: sn60/pb40 (normal), sn/3.0ag/0.5cu or pure-tin (pb-free) ? mold compound: epoxy resin family, flammabilit y solid burnin g class: ul94v-0 dim min. max. a 5.58 7.49 b 8.38 8.90 c 4.40 4.70 d 1.15 ...
Description	Schottky Barrier Rectifiers (Reverse Voltage 100V to150V, Forward Current 10A)
File Size	132.68K / 4 Page	View it Online	Download Datasheet

				Hi-Sincerity Mocroelectronics
Part No.	H02N65
OCR Text	...erial: ? lead solder plating: sn60/pb40 (normal), sn/3.0ag/0.5cu or pure-tin (pb-free) ? mold compound: epoxy resin family, flammability solid bu rning class: ul94v-0 3-lead to-220ab plastic package hsmc package code: e to-220...
Description	N-Channel Power Field Effect Transistor
File Size	124.60K / 6 Page	View it Online	Download Datasheet

				State of the Art, Inc.
Part No.	S1005CA6R8GEB-TR S1005CA6R8GKB-TR S1005CA6R8GHB-TR S1005CA6R8GHW-TR S1005CA6R8GEW-TR S1005CA6R8GKW-TR
OCR Text	...h b - tr termination finish: b: sn60 over nickel barrier w: gold termination finish: b: sn60 over nickel barrier w: gold packaging code: - tr = tape/reel - w = waffle carrier (default packaging is bulk) packaging code: -tr = tape/reel - w =...
Description	RESISTOR, THIN FILM, 0.25 W, 2 %, 25 ppm, 6.8 ohm, SURFACE MOUNT, 1005 CHIP RESISTOR, THIN FILM, 0.25 W, 2 %, 100 ppm, 6.8 ohm, SURFACE MOUNT, 1005 CHIP RESISTOR, THIN FILM, 0.25 W, 2 %, 50 ppm, 6.8 ohm, SURFACE MOUNT, 1005 CHIP
File Size	88.45K / 1 Page	View it Online	Download Datasheet

				Hi-Sincerity Mocroelectronics HSMC
Part No.	HSB857J
OCR Text	...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A C F G H L M N a1 a2 a5 Min. 6.35 4.80 1.30 5.40 2.20 0.40 2....
Description	PNP EPITAXIAL PLANAR TRANSISTOR
File Size	42.37K / 4 Page	View it Online	Download Datasheet

				State of the Art, Inc.
Part No.	S0505CPC6R04F30 S0505CPC5904F20 S0505CPC6R04F20 S0505CPC5904F10 S0505CPC5904F30 S0505CPC6R04F10 S0505CPC5904F20-TR S0505CPC6R04F10-TR S0505CPC5904F30-TR S0505CPC5904F10-TR
OCR Text	...% m: 20% termination finish: x: sn60 over nickel (solderable) c: silver bearing (epoxy bondable-rohs) g: gold (epoxy bondable-rohs) y: silver over nickel (solderable -rohs) z: gold over nickel (solderable-rohs) termination finish: x: sn60 o...
Description	RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 1 %, 300 ppm, 6.04 ohm, SURFACE MOUNT, 0505 CHIP, ROHS COMPLIANT RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 1 %, 200 ppm, 5900000 ohm, SURFACE MOUNT, 0505 CHIP, ROHS COMPLIANT RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 1 %, 200 ppm, 6.04 ohm, SURFACE MOUNT, 0505 CHIP, ROHS COMPLIANT RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 1 %, 100 ppm, 5900000 ohm, SURFACE MOUNT, 0505 CHIP, ROHS COMPLIANT RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 1 %, 300 ppm, 5900000 ohm, SURFACE MOUNT, 0505 CHIP, ROHS COMPLIANT RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 1 %, 100 ppm, 6.04 ohm, SURFACE MOUNT, 0505 CHIP, ROHS COMPLIANT
File Size	115.10K / 1 Page	View it Online	Download Datasheet

				State of the Art, Inc.
Part No.	S0603CA9R09FEW S0603CA9R09FEW-TR S0603CA9R09FEB-TR
OCR Text	...h b - tr termination finish: b: sn60 over nickel barrier w: gold termination finish: b: sn60 over nickel barrier w: gold packaging code: - tr = tape/reel - w = waffle carrier (default packaging is bulk) packaging code: -tr = tape/reel - w =...
Description	RESISTOR, THIN FILM, 0.1 W, 1 %, 25 ppm, 9.09 ohm, SURFACE MOUNT, 0603 CHIP
File Size	92.21K / 1 Page	View it Online	Download Datasheet

For sn60 Found Datasheets File :: 239 Search Time::1.406ms
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