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  soldered-in Datasheet PDF File

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    LTC3676ELXEPBF LTC3676ELXE-1PBF LTC3676ILXEPBF

Linear Technology
Part No. LTC3676ELXEPBF LTC3676ELXE-1PBF LTC3676ILXEPBF
OCR Text ... pad (pin 41) is gnd, must be soldered to pcb 39 40 38 37 36 35 34 33 32 31 11 20 12 13 14 15 top view 41 gnd uj package 40-lead (6mm 6...in_l2 ldo2ldo3 v in_l3 ldo4 v in_l4 vddqin vttr en_l3 en_l2on ldo1 v in fb_l1fb_b2 fb_b1 fb_b4 fb_b3...
Description Power Management Solution for Application Processors

File Size 540.46K  /  38 Page

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    MICREL[Micrel Semiconductor]
Part No. SY89531LHCTR SY89531LHC SY89531LHH SY89531LHHTR SY89531L MICRELINC-SY89531LHHTR
OCR Text ...ly. Ground: Exposed pad must be soldered to a ground plane. Configuration Pin Number 4 Pin Name VCO_SEL Pin Function LVTTL/CMOS Compatib...In" Compatible Input Pair. Allows for external VCO connection. The "Any In" input structure accepts ...
Description 3.3V, PRECISION, 33MHz to 500MHz PROGRAMMABLE LVPECL AND HSTL BUS CLOCK SYNTHESIZER

File Size 101.61K  /  16 Page

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    SA58631 SA58631TK

Philips Semiconductors
Part No. SA58631 SA58631TK
OCR Text ...point Rth is 28 K/W with DAP soldered to 5 square inch, 1 ounce copper heat spreader. SA58631 (c) Koninklijke Philips Electronics N...in test circuit Figure 3; unless otherwise specified. Symbol VCC Iq Istb VO IIB(IN+) IIB(IN-) VMODE ...
Description 3 W BTL audio amplifier

File Size 168.84K  /  19 Page

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    Agilent (Hewlett-Packard)
Part No. 8302401FX 6N883B-600 6N883B-100 6N883B-200 6N883B-300
OCR Text ...d Butt Cut/Gold Plate Gull Wing/Soldered Crew Cut/Gold Plate Class H SMD Part # Prescript for all below Either Gold or Solder Gold Plate Sol...IN MILLIMETERS (INCHES). Leaded Device Marking Agilent DESIGNATOR Agilent P/N DSCC SMD* DSCC SMD...
Description Hermetically Sealed Low IF Wide VCC High Gain Optocouplers

File Size 323.20K  /  13 Page

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    UPGT801-S

Seoul Semiconductor
Part No. UPGT801-S
OCR Text ...e done after the leds have been soldered. (7) reflow soldering should not be done more than two times. in the case of more than 24 hours passed soldering after first, leds will be damaged. z-power led x10490 z-power led x10490 technical ...
Description    Industry Standard PLCC SMT package

File Size 238.25K  /  12 Page

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    NCSW170B

NICHIA CORPORATION
Part No. NCSW170B
OCR Text ...is led is designed to be reflow soldered on to a pcb. if dip soldered or hand soldered, nichia cannot guarantee its reliability. * r...in the first figure from the right. placement pressure 3.5n/mm2 * max. force: 5n va...
Description    Built-in ESD Protection Device

File Size 339.85K  /  18 Page

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    NJSW172A

NICHIA CORPORATION
Part No. NJSW172A
OCR Text ...is led is designed to be reflow soldered on to a pc b. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must ...in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause...
Description    Built-in ESD Protection Device

File Size 317.16K  /  17 Page

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    NSSM032A

NICHIA CORPORATION
Part No. NSSM032A
OCR Text ...is led is designed to be reflow soldered on to a pc b. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must ...in order to avoid moisture absorption. * avoid rapid cooling. ramp down the temp erature graduall...
Description    rohs compliant

File Size 531.24K  /  17 Page

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