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  43045-1827 Datasheet PDF File

For 43045-1827 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Molex
Part No. 43045-XXXX
Description Single and Dual Row Micro-Fit 3.0 Connectors

File Size 81.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43045-1624

Molex Electronics Ltd.
Part No. 43045-1624
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 16 Circuits

File Size 182.72K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs    

Official Product Page

    43045-1812

Molex Electronics Ltd.
Part No. 43045-1812
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits

File Size 166.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-827-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 08 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-1628

Molex Electronics Ltd.
Part No. 43045-1628
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 16 Circuits
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 16 Circuits

File Size 166.23K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-827-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-0820

Molex Electronics Ltd.
Part No. 43045-0820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 8 Circuits

File Size 174.46K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-827-28LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-0821

Molex Electronics Ltd.
Part No. 43045-0821
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits

File Size 183.77K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-518-27LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-0822

Molex Electronics Ltd.
Part No. 43045-0822
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits

File Size 183.86K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-827-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-0823

Molex Electronics Ltd.
Part No. 43045-0823
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row,

File Size 183.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-827-13LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-0824

Molex Electronics Ltd.
Part No. 43045-0824
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits

File Size 182.72K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-827-23LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-0825

Molex Electronics Ltd.
Part No. 43045-0825
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits

File Size 182.53K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-827-33LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 43045-1827 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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