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  52601-G30-4LF Datasheet PDF File

For 52601-G30-4LF Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    G301K

GTM CORPORATION
Part No. G301K
Description    N-CHANNEL ENHANCEMENT MODE POWER MOSFET

File Size 294.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 52601-G30-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 30 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    AG302-63-15

TriQuint Semiconductor
Part No. AG302-63-15
Description Lead-free/green/RoHS-compliant SOT-363 package

File Size 447.45K  /  5 Page

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Amphenol Communications Solutions

Part No. 52601-G44-8TLF
Description Quickie Header, Wire to Board Connector, Double Row, 44 Positions, 2.54 mm (0.1 in.), SMT Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    AG302-86-15

TriQuint Semiconductor
Part No. AG302-86-15
Description Lead-free/green/RoHS-compliant SOT-86 package

File Size 245.01K  /  5 Page

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Amphenol Communications Solutions

Part No. 52601-S34-4LF
Description Quickie® IDC Cable-to-Board Connector System, Shrouded Vertical Header, Through Hole, Low Profile, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    FI-G30S-VF25

Japan Aviation Electronics Industry, Ltd.
Part No. FI-G30S-VF25
Description CONTACT COPPER ALLOY

File Size 126.35K  /  1 Page

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Amphenol Communications Solutions

Part No. 52601-G20-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 20 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    GTM
Part No. G3018
Description N-CHANNEL MOSFET

File Size 345.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 52601-S50-6LF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    FI-G30C2

Japan Aviation Electronics Industry, Ltd.
Part No. FI-G30C2
Description CONTACT COPPER ALLOY

File Size 110.87K  /  1 Page

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Amphenol Communications Solutions

Part No. 52601-S10-6
Description Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

   
Part No. ICE-063-SD2-TG30
Description DIP6, IC SOCKET

File Size 34.28K  /  1 Page

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Amphenol Communications Solutions

Part No. 52601-S44-6
Description Quickie Header, Wire to Board Connector, Double Row, 44 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    G3018

GTM CORPORATION
Part No. G3018
Description N-CHANNEL MOSFET

File Size 336.03K  /  4 Page

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Amphenol Communications Solutions

Part No. 52601-G30-8TLF
Description Quickie Header, Wire to Board Connector, Double Row, 30 Positions, 2.54 mm (0.1 in.), SMT Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    G30 SMG30

Tyco Electronics
Part No. G30 SMG30
Description Voltage-Controlled Attenuator Module 100 to 2000 MHz

File Size 465.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 52601-G60-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 60 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    HV Component
Part No. G10F G30F
Description NV/ G-Low Current High Voltage Rectifiers

File Size 42.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 52601-S60-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 60 Positions, 2.54 mm (0.1 in.), SMT Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

For 52601-G30-4LF Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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