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  74139-5540 Datasheet PDF File

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    74139-5060 0741395060

Molex Electronics Ltd.
Part No. 74139-5060 0741395060
Description 1.27mm (.050) Pitch EBBI 50D Plug, Surface Mount, Vertical, 60 Circuits, 3.00mm(.118) Retention Clip
File Size 159.23K  /  4 Page

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Texas Instruments
Part No. U5B7741393
Description Operational Amplifier 8-TO-99 0 to 70
Tech specs 　 　

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HUA FENG CIRCUIT





    74139-5068 0741395068

Molex Electronics Ltd.
Part No. 74139-5068 0741395068
Description 1.27mm (.050) Pitch EBBI 50D Plug, Surface Mount, Vertical, 68 Circuits, 3.00mm(.118) Retention Clip
File Size 159.23K  /  4 Page

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Amphenol Communications Solutions
Part No. 68655-407HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 7 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail.
Tech specs 　 　

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    74139-5100 0741395100

Molex Electronics Ltd.
Part No. 74139-5100 0741395100
Description 1.27mm (.050) Pitch EBBI 50D Plug, Surface Mount, Vertical, 100 Circuits
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 68655-404HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail.
Tech specs 　 　

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    ATS-55400D-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55400D-C2-R0
Description High Performance BGA Cooling
File Size 266.53K  /  1 Page

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Amphenol Communications Solutions
Part No. 68655-406HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail.
Tech specs 　 　

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    ATS-55400R-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55400R-C2-R0
Description High Performance BGA Cooling
File Size 266.54K  /  1 Page

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Amphenol Communications Solutions
Part No. 66925-540LF
Description Dubox®, Board To Board Connector, Horizontal Card Connector, Double Row, 80 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

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    ATS-55400W-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55400W-C2-R0
Description High Performance BGA Cooling
File Size 266.54K  /  1 Page

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Amphenol Communications Solutions
Part No. 72305-540LF
Description Card Bus Ass'y, Bottom Mount, S/D(68Pins), VTB, Type 123, 3.3V, 4.3mm s/o, Non-Eject
Tech specs 　 　

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    ATS-55400W-C1-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55400W-C1-R0
Description High Performance X-CUT - Heat Sink, T412, BLACK-ANODIZED
File Size 229.85K  /  1 Page

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Amphenol Communications Solutions
Part No. 68655-401HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail.
Tech specs 　 　

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    ATS-55400D-C1-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55400D-C1-R0
Description High Performance X-CUT - Heat Sink, T412, BLACk-ANODIZED
File Size 229.87K  /  1 Page

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Amphenol Communications Solutions
Part No. 10157554-00441LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Cable Receptacle, 4 Position, Without TPA & CPA
Tech specs 　 　

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    ATS-55400R-C1-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-55400R-C1-R0
Description High Performance X-CUT - Heat Sink, T412, BLACk-ANODIZED
File Size 229.84K  /  1 Page

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Amphenol Communications Solutions
Part No. 10157554-00821LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Cable Receptacle, 8 Position, With TPA/Without CPA
Tech specs 　 　

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    5540 SD-130098-003

Molex Electronics Ltd.
Part No. 5540 SD-130098-003
Description MAX-LOC Strain Relief Cord-Sealing Grip, 3/4 NPT, Straight Female, Cable Diameter 14.27-17.45mm (.562-.687)
MAX-LOC Strain Relief Cord-Sealing Grip, 3/4" NPT, Straight Female, Cable Diameter 14.27-17.45mm (.562-.687")
File Size 146.98K  /  2 Page

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Amphenol Communications Solutions
Part No. 10157554-01041LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Cable Receptacle, 10 Position, Without TPA & CPA
Tech specs 　 　

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