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  76135-8501 Datasheet PDF File

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    85015-0141

Molex Electronics Ltd.
Part No. 85015-0141
Description 2.54mm (.100) Pitch DIN 41612 Header, 4-Row C-Pin, Press-Fit Style R Reverse, Vertical, Through Hole, 0.6μm (24μ) Gold (Au), 128 Circuits, Lead free
File Size 69.39K  /  3 Page

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Rochester Electronics LLC
Part No. 8501002YC
Description 8501002YC - Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68 - Dual marked (MQ80186-6/BYC)
Tech specs 　 　

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HUA FENG CIRCUIT





    Molex, Inc.
Part No. 85013-2036
Description DINCONN. R/2 MALE 48CKT 850132036 48 CONTACT(S), MALE, STRAIGHT TWO PART EURO CONNECTOR, SOLDER
File Size 233.38K  /  5 Page

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Rochester Electronics LLC
Part No. 8501001YA
Description 80186 - High-Integration 16-Bit Microprocessor, CQFP68 (8501001YA)
Tech specs 　 　

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    Molex, Inc.
Part No. 85015-0036
Description DINCONN.R MALE PF 128CKT 850150036 128 CONTACT(S), MALE, STRAIGHT TWO PART EURO CONNECTOR, PRESS FIT
File Size 56.72K  /  1 Page

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Amphenol Communications Solutions
Part No. 91276-135HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs 　 　

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    Molex, Inc.
Part No. 85013-3081
Description DINCONN. R MALE 96CKT. 850133081 96 CONTACT(S), MALE, STRAIGHT TWO PART EURO CONNECTOR, SOLDER
File Size 129.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 95278-501-50LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    Molex, Inc.
Part No. 85013-1677
Description DINCONN. R MALE 64CKT 850131677 64 CONTACT(S), MALE, STRAIGHT TWO PART EURO CONNECTOR, SOLDER
File Size 120.95K  /  3 Page

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Amphenol Communications Solutions
Part No. 95278-501-18LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    ams AG
Part No. AS8501-06
Description High precision voltage and current measurement sensor interface
File Size 1,087.75K  /  41 Page

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Amphenol Communications Solutions
Part No. 95278-501-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    885010

TriQuint Semiconductor
Part No. 885010
Description 2442 GHz BAW Filter
File Size 656.43K  /  6 Page

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Amphenol Communications Solutions
Part No. 68585-016LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 40 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs 　 　

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    MJ8501

Inchange Semiconductor Company Limited
Part No. MJ8501
Description Silicon NPN Power Transistor
File Size 105.32K  /  2 Page

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Amphenol Communications Solutions
Part No. 95278-501A08LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    WM8501

Cirrus Logic
Part No. WM8501
Description    24-bit 192kHz Stereo DAC with 1.7Vrms Line Driver
File Size 319.50K  /  21 Page

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Amphenol Communications Solutions
Part No. 95278-501A30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    LR8501

Leshan Radio Company
Part No. LR8501
Description 1.5MHz 600mA Synchronous Step-Down Converter with Low Quiescent Current
File Size 756.58K  /  11 Page

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Amphenol Communications Solutions
Part No. 95278-501B12LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

For 76135-8501 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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