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  85013-1768 Datasheet PDF File

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    CYSTEKEC[Cystech Electonics Corp.]
Part No. BTD1768N3
Description General Purpose NPN Epitaxial Planar Transistor
File Size 175.77K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131768-11JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 14 column, 280 position, Right Angle Receptacle, Right Guide Pin.
Tech specs 　 　

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HUA FENG CIRCUIT





    Cystech Electonics Corp...
Part No. BTD1768S3
Description General Purpose NPN Epitaxial Planar Transistor
File Size 223.20K  /  6 Page

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Amphenol Communications Solutions
Part No. 10131768-101LF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 14 column, 280 position, Right Angle Receptacle, No Guide Pin.
Tech specs 　 　

Official Product Page

    Cystech Electonics Corp...
Part No. BTD1768M3
Description NPN Epitaxial Planar Transistor
File Size 201.06K  /  6 Page

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Amphenol Communications Solutions
Part No. 10131768-12JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 14 column, 280 position, Right Angle Receptacle, Left Guide Pin.
Tech specs 　 　

Official Product Page

    Advanced Monolithic Systems, Inc.
Part No. 5962-90585013X
Description 8-Bit D-Type Latch 8位D型锁存器
File Size 777.40K  /  13 Page

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Amphenol Communications Solutions
Part No. 95278-501-38LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    Sanyo
Part No. 2SC4612 2SA1768
Description NPN Epitaxial Planar Silicon Transistors High-Voltage Switching Applications
PNP/NPN Epitaxial Planar Silicon Transistors
File Size 153.32K  /  5 Page

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Amphenol Communications Solutions
Part No. 95278-501-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    LPC1764 LPC1765 LPC1766 LPC1768

NXP Semiconductors
Part No. LPC1764 LPC1765 LPC1766 LPC1768
Description 32-bit ARM Cortex-M3 microcontroller up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN
File Size 294.60K  /  72 Page

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Amphenol Communications Solutions
Part No. 95278-501-34LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    597-2222-602F 597-2222-607F 597-2901-602F 597-2901-607F 597-2601-602F 597-2601-607F C-17683 597-2211-602F 597-2211-607F

Dialight Corporation
http://
Part No. 597-2222-602F 597-2222-607F 597-2901-602F 597-2901-607F 597-2601-602F 597-2601-607F C-17683 597-2211-602F 597-2211-607F 597-2002-602F 597-2002-607F 597-2501-607F 597-2501-602F
Description 1208 SIDE VIEW CHIP LED RoHS COMPLIANT
File Size 193.32K  /  1 Page

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Amphenol Communications Solutions
Part No. 95278-501-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    LPC1764 LPC1766 LPC1768 LPC1765

NXP Semiconductors
Part No. LPC1764 LPC1766 LPC1768 LPC1765
Description 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN
File Size 489.28K  /  66 Page

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Amphenol Communications Solutions
Part No. 95278-501-32LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    0850132012 85013-2012

Molex Electronics Ltd.
Part No. 0850132012 85013-2012
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse1μm (40μ) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse1渭m (40渭") Selective Gold (Au), 48 Circuits, Lead free
File Size 267.35K  /  8 Page

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    0850133225 85013-3225

Molex Electronics Ltd.
Part No. 0850133225 85013-3225
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 64 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 64 Circuits, Lead free
File Size 125.17K  /  5 Page

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