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  87760-1816 Datasheet PDF File

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    87758-1816

Molex Electronics Ltd.
Part No. 87758-1816
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Texas Instruments

Part No. 5962-8776001SRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43045-1816

Molex Electronics Ltd.
Part No. 43045-1816
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 18 Circuits

File Size 174.08K  /  3 Page

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Texas Instruments

Part No. 5962-8776001MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

    87914-1816

Molex Electronics Ltd.
Part No. 87914-1816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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Texas Instruments

Part No. 5962-8776001M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs    

Official Product Page

    SD-91816-001 91816-0014

Molex Electronics Ltd.
Part No. SD-91816-001 91816-0014
Description C-Grid Vertical Header Assembly, Dual Row, 14 Circuits

File Size 113.50K  /  3 Page

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Texas Instruments

Part No. 5962-8776001SSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

    AN1816

Freescale Semiconductor, Inc
Part No. AN1816
Description USING THE HC912B32 TO IMPLEMENT THE DISTRIBUTED SYSTEMS INTERFACE (DSI) PROTOCOL

File Size 434.54K  /  24 Page

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Texas Instruments

Part No. 5962-8776001MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

    AD1816

Analog Devices
Part No. AD1816
Description Single chip Plug and Play multimedia audio subsystem

File Size 481.63K  /  52 Page

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Amphenol Communications Solutions

Part No. 77315-118-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    飞思卡尔半导体(中国)有限公司
Part No. AN1816
Description USING THE HC912B32 TO IMPLEMENT THE DISTRIBUTED SYSTEMS INTERFACE (DSI) PROTOCOL

File Size 325.54K  /  24 Page

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Amphenol Communications Solutions

Part No. 54121-816142500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. CH1816
Description Telecommunication IC 通信集成电路

File Size 203.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 10118169-001LF
Description HPCE STMT REC 16P16S
Tech specs    

Official Product Page

    LB1816

SANYO[Sanyo Semicon Device]
Part No. LB1816
Description Optical/magnetic Disk Spindle Motor Driver
LB1816

File Size 59.94K  /  8 Page

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Amphenol Communications Solutions

Part No. 71918-160
Description Quickie Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 60 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    DS1816 DS1816-10 DS1816-15 DS1816-5

MAXIM - Dallas Semiconductor
Dallas Semiconducotr
Part No. DS1816 DS1816-10 DS1816-15 DS1816-5
Description 3.3V EconoReset with Open Drain Output

File Size 50.08K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-518-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

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