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  die-19 Datasheet PDF File

For die-19 Found Datasheets File :: 17755    Search Time::1.828ms    
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    SL3522NA1C SL3522CMC SL3522 SL3522AMC

ZARLINK[Zarlink Semiconductor Inc]
Part No. SL3522NA1C SL3522CMC SL3522 SL3522AMC
OCR Text ... temperature Thermal resistance Die-to-case Die-to-ambient Applied DC voltage to RF input Applied RF power to RF input MC28 Fig.1 Pin ...19 3, 5, 7, 20, 22, 24, 26 VEE 4, 6, 8, 21, 23, 25 GND GAIN ADJ 18 RG 17 RT RO OFFSET ADJ F...
Description 500MHz 75dB Logarithmic/Limiting Amplifier

File Size 929.19K  /  21 Page

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    PA2423U-EV1 PA2423U-R PA2423U

SIGE[SiGe Semiconductor, Inc.]
Part No. PA2423U-EV1 PA2423U-R PA2423U
OCR Text ...of the PA2423U, and its exposed die-pad package, soldered to the system PCB, provide high thermal conductivity and a subsequently low juncti...19 20 21 22 23 24 25 2Fo Harmonic (dBc) -35 -40 -45 -50 -55 -60 -65 -70 -40 -45 -50 -55 -60...
Description RangeChargerTM 2.4 GHz Bluetoothtm Power Amplifier IC Preliminary

File Size 226.47K  /  10 Page

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    ADN2847ACP-32 ADN2847ACP-32-RL ADN2847ACP-32-RL7 ADN2847ACP-48 ADN2847ACP-48-RL ADN2847

AD[Analog Devices]
Analog Devices, Inc.
Part No. ADN2847ACP-32 ADN2847ACP-32-RL ADN2847ACP-32-RL7 ADN2847ACP-48 ADN2847ACP-48-RL ADN2847
OCR Text ... mm) LFCSP Package Available in Die Form 3 V Dual-Loop 50 Mbps to 3.3 Gbps Laser Diode Driver ADN2847 APPLICATIONS SONET OC-1/3/12/48 SD...19 20 21 22 23 24 25 26 27 28 29 Pad Name TP1 (GND) LBWSET ASET ERSET PSET TP2 (GND) IMPD IMPDMON...
Description    3 V Dual-Loop 50 Mbps to 3.3 Gbps Laser Diode Driver
Anyrate from 50 Mbps to 3.3 Gbps, Dual-loop Control Laser Diode Driver IC
3 V Dual-Loop 50 Mbps to 3.3 Gbps Laser Diode Driver SPECIALTY INTERFACE CIRCUIT, QCC32

File Size 380.84K  /  12 Page

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    SBB-1000

RF Micro Devices
http://
Part No. SBB-1000
OCR Text ...T MMIC AMPLIFIER Package: Bare Die Product Description RFMD's SBB-1000 is a high performance InGaP HBT MMIC amplifier utilizing a Darli...19.0 dBm Freq=1000MHz 42.0 dBm Freq=250MHz Output IP3 40.5 dBm Freq=500MHz 35.5 dBm Freq=1000MHz Inp...
Description 50MHZ TO 1000MHZ, CASCADABLE ACTIVE BIAS InGaP HBT MMIC AMPLIFIER

File Size 201.90K  /  6 Page

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    Samsung Electronic
Part No. M377S1723AT3 M377S3323AT0SDRAMDIMMINTEL1.2VERB M377S3320AT3SDRAMDIMMINTEL1.2VERB
OCR Text ...v1.2 spd specification(128mb a-die base) august 1999 serial presence detect rev. 0.0 aug. 1999 pc100 registered dimm m377s1723at3-c1h/c1...19 sdram device attributes : cs latency 0 clk 01h 20 sdram device attributes : write latency 0 clk 0...
Description 16Mx72 SDRAM DIMM with PLL & Register based on 16Mx8, 4Banks 4K Ref., 3.3V Synchronous DRAMs with SPD Serial Presence Detect
32MBx72 SDRAM DIMM with PLL & Register based on 16MBx8, 4Banks 4KB Ref., 3.3V Synchronous DRAMs with SPD Serial Presence Detect
32MBx72 SDRAM DIMM with PLL & Register based on 32MBx4, 4Banks, 4KB Ref., 3.3V Synchronous DRAMs with SPD Data Sheet

File Size 73.28K  /  9 Page

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    HMC-APH46209

Hittite Microwave Corporation
Part No. HMC-APH46209
OCR Text ...+5v 50 ohm matched input/output die size: 3.70 x 2.62 x 0.1 mm electrical speci cations [1] t a = +25 c, vdd1 = vdd2 = vdd3 = vdd4 = 5v, ...19 20 21 22 23 24 25 26 27 ip3@18dbm/tone p3db p1db pout (dbm), ip3 (db) frequency (ghz) -45 -40 -35...
Description GaAs HEMT MMIC 1 WATT POWER AMPLIFIER, 15 - 27 GHz

File Size 232.63K  /  6 Page

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    CGB7003-BD-000V CGB7003-BD07 CGB7003-BD

Mimix Broadband, Inc.
MIMIX[Mimix Broadband]
Part No. CGB7003-BD-000V CGB7003-BD07 CGB7003-BD
OCR Text ...r Testing ESD Protection on All Die: >1000V HBM Low Thermal Resistance: <85C/Watt Chip Layout Absolute Maximum Ratings Max Device Vol...19.5 19.3 15.6 15.0 30.0 29.0 46 42 14.0 13.0 17 16 20.7 20.7 16.6 16.6 31.5 31.5 2.9 2.9 50 5...
Description DC-6.0 GHz InGaP HBT MMIC Matched Gain Block Amplifier

File Size 491.34K  /  7 Page

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    CGB7003-SC-0G00 CGB7003-SC-0G0T CGB7003-BD PB-CGB7003-SP-0000 CGB7003-SC CGB7003-SP-0G00 CGB7003-SP-0G0T PB-CGB7003-SC-0

MIMIX[Mimix Broadband]
Part No. CGB7003-SC-0G00 CGB7003-SC-0G0T CGB7003-BD PB-CGB7003-SP-0000 CGB7003-SC CGB7003-SP-0G00 CGB7003-SP-0G0T PB-CGB7003-SC-0000
OCR Text ...tion Over Temperature Low Cost: Die Form or SOT-89 Package 100% DC On-Wafer Testing ESD Protection on All Die: >1000V HBM Low Thermal Resist...19.5 19.3 15.6 15.0 30.0 29.0 46 42 14.0 13.0 17 16 20.7 20.7 16.6 16.6 31.5 31.5 2.9 2.9 50 5...
Description 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
DC-6.0 GHz InGaP HBT, MMIC or Packaged, Matched Gain Block Amplifier

File Size 470.04K  /  7 Page

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    HMC-AUH31711

Hittite Microwave Corporation
Part No. HMC-AUH31711
OCR Text ...o hm m atched i nput/ o utput die s ize: 2.65 x 1.6 x 0.05 mm typical applications this hm c-au h 317 is ideal for: ? short haul / high...19 22 db i nput r eturn l oss 9 db o utput r eturn l oss 5 db o utput power for 1db compression ...
Description GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 81 - 86 GHz

File Size 325.82K  /  6 Page

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    CGB7004-BD-000V CGB7004-BD

Mimix Broadband, Inc.
MIMIX[Mimix Broadband]
Part No. CGB7004-BD-000V CGB7004-BD
OCR Text ...r Testing ESD Protection on All Die: >1000V HBM Low Thermal Resistance: <85C/Watt Chip Layout Absolute Maximum Ratings Max Device Vol...19.1 -23.2 -27.3 -31.3 -35.4 -39.5 -43.7 0.103 0.104 0.104 0.104 0.105 0.106 0.106 0.107 0.108 0....
Description DC-6.0 GHz InGaP HBT MMIC Matched Gain Block Amplifier

File Size 427.38K  /  7 Page

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