| |
|
 |
AVAGO TECHNOLOGIES LIMI...
|
| Part No. |
ACFM-7024
|
| OCR Text |
...s avago technologies innovative microcap bonded-wafer, chip scale packaging technology. this process allows the filters to be assembled in a module with a footprint of only 3.6 mm 2 mm with a maximum height of 0.80 mm. low tx insertion ... |
| Description |
Single antenna
|
| File Size |
237.28K /
2 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
AVAGO TECHNOLOGIES LIMI...
|
| Part No. |
ACFM-7037
|
| OCR Text |
... avago technologies' innovative microcap bonded-wafer, chip scale packaging technology. this process allows the filters to be assembled in a module with a footprint of only 3.6 mm 2 mm with a maximum height of 0.80 mm. low tx insertion... |
| Description |
Single antenna
|
| File Size |
242.37K /
2 Page |
View
it Online |
Download Datasheet |
| |
|
|
AVAGO TECHNOLOGIES LIMI...
|
| Part No. |
ACFM-7107 ACFM-7107-BLK ACFM-7107-TR1
|
| OCR Text |
... avago technologies innovative microcap bonded-wafer, chip scale packaging technol- ogy. this process allows the fi lters to be assembled in a module with a footprint of only 4 x 7 mm with a maximum height of 1.2 mm. low tx insertion l... |
| Description |
PCS/Cellular Band Quadplexer
|
| File Size |
478.70K /
18 Page |
View
it Online |
Download Datasheet |
| |
|
|
AVAGO TECHNOLOGIES LIMI...
|
| Part No. |
ACFM-7110
|
| OCR Text |
... avago technologies innovative microcap bonded-wafer, chip scale packaging technol- ogy. this process allows the ?lters to be assembled in a module with a footprint of only 3 x 5 mm and maximum height of 1.05 mm. low tx insertion loss o... |
| Description |
PCS/Cellular Band Quadplexer
|
| File Size |
242.15K /
13 Page |
View
it Online |
Download Datasheet |
| |
|
|
AVAGO TECHNOLOGIES LIMI...
|
| Part No. |
ACFM-7325
|
| OCR Text |
... avago technologies innovative microcap bonded-wafer, chip scale packaging technol- ogy. this process allows the filters to be assembled in a module with a footprint of only 4 x 7 mm with a maximum height of 1.2 mm. low tx insertion los... |
| Description |
Band Class 10 Cellular Band Quadplexer
|
| File Size |
425.82K /
19 Page |
View
it Online |
Download Datasheet |
| |
|
|
AVAGO TECHNOLOGIES LIMI...
|
| Part No. |
ACMD-4102
|
| OCR Text |
...es avago technologies advanced microcap bonded-wafer, chip scale packaging technology. this process allows the fi lters to be assembled into a molded chip-on-board module with an overall size of only 2.0 x 2.5 mm and maximum height of ... |
| Description |
UMTS/NCDMA/Co-band GSM Rx Band 2 Duplexer
|
| File Size |
256.38K /
12 Page |
View
it Online |
Download Datasheet |
| |
|
|
AVAGO TECHNOLOGIES LIMI...
|
| Part No. |
ACMD-6003 ACMD-6003-BLK
|
| OCR Text |
...es avago technologies advanced microcap bonded-wafer, chip scale packaging technology. this process allows the fi lters to be assembled into a molded chip-on-board module with an overall maximum size of only 2.0 x 2.5 mm and maximum he... |
| Description |
High Isolation
|
| File Size |
456.71K /
14 Page |
View
it Online |
Download Datasheet |
| |
|
|
AVAGO TECHNOLOGIES LIMI...
|
| Part No. |
ACMD-6007
|
| OCR Text |
...es avago technologies advanced microcap bonded-wafer, chip scale packaging technology. this process allows the filters to be assembled into a molded chip-on-board module with an overall maximum size of only 2.0 x 2.5 mm and maximum heig... |
| Description |
LTE Band 7 Duplexer
|
| File Size |
464.62K /
14 Page |
View
it Online |
Download Datasheet |
|
For
microcap Found Datasheets File :: 47 Search Time::3.016ms
Page :: | 1 | 2 | 3 | <4> | 5 | |
▲Up To
Search▲ |
|
Price and Availability
|
