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Edison
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Part No. |
ET-3528A-111W ET-3528B-111W
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OCR Text |
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The following reflow soldering profiles are provided for reference. It is recommended that users follow the recommended soldering profile provided by the manufacturer of the solder paste used
< Figure 10 Time-temperature of JEDEC J-STD-... |
Description |
ET-3528R/T/B/A-111W
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File Size |
671.33K /
20 Page |
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Advanced Interconnections
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Part No. |
2FGA320-638G 2FGAX241-720G
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OCR Text |
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See page 15 for Generic Reflow profiles. * Either Tin/Lead or Lead-free device packages can be attached to our RoHS Compliant Adapters. * PC boards can be processed with Tin/Lead BGA sockets in standard profiles or lead-free BGA sockets in... |
Description |
320 POS 1.27MM BGA ADAPTER 241 POS 1.27MM BGA SMT ADAPTER
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File Size |
1,033.97K /
4 Page |
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it Online |
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Advanced Interconnections
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Part No. |
2FGA520-720G
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OCR Text |
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See page 15 for Generic Reflow profiles. * Either Tin/Lead or Lead-free device packages can be attached to our RoHS Compliant Adapters. * PC boards can be processed with Tin/Lead BGA sockets in standard profiles or lead-free BGA sockets in... |
Description |
520 POS 1.27MM BGA SMT ADAPTER
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File Size |
724.79K /
2 Page |
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it Online |
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Fujitsu Media Devices
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Part No. |
MBH7BT08
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OCR Text |
... upper layer protocol stack and profiles have to be embedded on the user's host system when user uses conventional HCI module, MBH7BT08 includes upper layer protocol stack and several profiles. Therefore, MBH7BT08 makes it possible to reduc... |
Description |
Bluetooth Specification Version 1.1 Compliant
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File Size |
117.79K /
13 Page |
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it Online |
Download Datasheet |
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Price and Availability
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