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  43045-1827 Datasheet PDF File

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    43045-0826

Molex Electronics Ltd.
Part No. 43045-0826
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.76K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-1025

Molex Electronics Ltd.
Part No. 43045-1025
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 10 Circuits
File Size 182.53K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-0611

Molex Electronics Ltd.
Part No. 43045-0611
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 6 Circuits
File Size 176.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 08 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0613

Molex Electronics Ltd.
Part No. 43045-0613
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 6 Circuits
File Size 166.54K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0609

Molex Electronics Ltd.
Part No. 43045-0609
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 6 Circuits
File Size 176.76K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-28LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0614

Molex Electronics Ltd.
Part No. 43045-0614
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 6 Circuits
File Size 166.54K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-518-27LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0608

Molex Electronics Ltd.
Part No. 43045-0608
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 6 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0607

Molex Electronics Ltd.
Part No. 43045-0607
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 6 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-13LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1810

Molex Electronics Ltd.
Part No. 43045-1810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 180.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-23LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0606

Molex Electronics Ltd.
Part No. 43045-0606
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 6 Circuits
File Size 184.20K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-33LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

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