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  8240-8247 Datasheet PDF File

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    0545482471 54548-2471

Molex Electronics Ltd.
Part No. 0545482471 54548-2471
Description 0.50mm (.020") Pitch FFC/FPC Connector, 1.20mm (.047") Height, Right Angle, SMT,ZIF, Bottom Contact Style, 24 Circuits, Lead-free, Gold Contact Plating
0.50mm (.020) Pitch FFC/FPC Connector, 1.20mm (.047) Height, Right Angle, SMT,ZIF, Bottom Contact Style, 24 Circuits, Lead-free, Gold Contact Plating

File Size 530.23K  /  7 Page

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Texas Instruments

Part No. SN74BCT8240ADW
Description IEEE Std 1149.1 (JTAG) Boundary-Scan Test Device With Octal Inverting Buffers 24-SOIC 0 to 70
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    015-38-8247 0015388247

Molex Electronics Ltd.
Part No. 015-38-8247 0015388247
Description 2.54mm (.100) C-Grid SL Single Row, Female, Version C Receptacle, 24 Circuits

File Size 137.78K  /  3 Page

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Texas Instruments

Part No. SNJ54BCT8240AJT
Description Scan Test Devices With Octal Buffers 24-CDIP -55 to 125
Tech specs    

Official Product Page

    82402304 SOT23-6L

Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
Part No. 82402304 SOT23-6L
Description TVS Diode Array WE-TVS

File Size 223.28K  /  5 Page

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Texas Instruments

Part No. SNJ54BCT8240AFK
Description Scan Test Devices With Octal Buffers 28-LCCC -55 to 125
Tech specs    

Official Product Page

    SOT23-6L 82400102

Wurth Elektronik GmbH & Co. KG, Germany.
Part No. SOT23-6L 82400102
Description TVS Diode Array WE-TVS

File Size 230.26K  /  5 Page

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Amphenol Communications Solutions

Part No. 86094647824755E1LF
Description DIN Straight Header Solder-to-Board Style R 64 ways, Class II
Tech specs    

Official Product Page

    KTD1824 KTD182408

KEC(Korea Electronics)
Part No. KTD1824 KTD182408
Description USM PACKAGE

File Size 14.16K  /  1 Page

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Amphenol Communications Solutions

Part No. 77313-824-70LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 70 Positions
Tech specs    

Official Product Page

    SONY
Part No. CXP82400A
Description CMOS 8-bit Single Chip Microcomputer Piggyback/eva

File Size 175.62K  /  5 Page

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Amphenol Communications Solutions

Part No. 86094327824758E1LF
Description DIN Straight Header Solder-to-Board Style R 32 ways, Class II
Tech specs    

Official Product Page

    CXP82400A

SONY[Sony Corporation]
Part No. CXP82400A
Description CMOS 8-bit Single Chip Microcomputer

File Size 277.28K  /  5 Page

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Amphenol Communications Solutions

Part No. 48247-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs    

Official Product Page

    SI-80506Z SI-82412Z SI-82406Z

Sanken Electric
Part No. SI-80506Z SI-82412Z SI-82406Z
Description SI-80000Z

File Size 259.69K  /  4 Page

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Amphenol Communications Solutions

Part No. RJE4A188247RT
Description Modular Jack - 8P8C, Vertical, Cat6A, THR, No Panel Stops, Single Port, Shield With No EMI Tabs, With LEDs, With Straight Pegs
Tech specs    

Official Product Page

    MOTOROLA[Motorola, Inc]
Part No. MPC8240EC MPC8240
Description Integrated Processor Hardware Specifications

File Size 761.71K  /  52 Page

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Amphenol Communications Solutions

Part No. 68482-470HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 70 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TCM8240MD

Toshiba Semiconductor
Part No. TCM8240MD
Description 1.3 Mega pixel sensor chip

File Size 282.10K  /  30 Page

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Amphenol Communications Solutions

Part No. 86093967824765E1LF
Description DIN Straight Header Solder-to-Board Style R 96 ways, Class I
Tech specs    

Official Product Page

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Part: 8240-2WM
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