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  87832-0826 Datasheet PDF File

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    87832-5523

Molex Electronics Ltd.
Part No. 87832-5523
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Pick-and-Place Cap
File Size 386.42K  /  6 Page

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Renesas Electronics Corporation
Part No. M30826MH-XXXGP
Description 32-bit Microcomputers (Non Promotion), , /
Tech specs 　 　

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HUA FENG CIRCUIT





    87832-1616

Molex Electronics Ltd.
Part No. 87832-1616
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows
File Size 345.79K  /  5 Page

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Amphenol Communications Solutions
Part No. 54112-808260900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87832-6222

Molex Electronics Ltd.
Part No. 87832-6222
Description 2.00mm (.079 Side and Center Locking Windows, with Center Polarization Slot, with PCB Locator, Embossed
File Size 367.63K  /  6 Page

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Amphenol Communications Solutions
Part No. 98414-G08-26ULF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header, Through Hole, Double Row, 26 Position ,2.00mm (0.079in) Pitch.
Tech specs 　 　

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    87832-4420

Molex Electronics Ltd.
Part No. 87832-4420
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 44 Circuits, 0.38μm (15μ) Gold (Au) Plating
File Size 367.52K  /  6 Page

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Amphenol Communications Solutions
Part No. 61083-082606LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    87832-1416

Molex Electronics Ltd.
Part No. 87832-1416
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows
File Size 345.91K  /  5 Page

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Amphenol Communications Solutions
Part No. 61083-082600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    87832-1822

Molex Electronics Ltd.
Part No. 87832-1822
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap
File Size 367.60K  /  6 Page

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Amphenol Communications Solutions
Part No. 61082-082600LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    87832-1821

Molex Electronics Ltd.
Part No. 87832-1821
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Lead free, 18 Circuits, 0.76μm (30μ) Gold (Au) Plating
File Size 386.31K  /  6 Page

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Amphenol Communications Solutions
Part No. 61082-082602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    87832-1820

Molex Electronics Ltd.
Part No. 87832-1820
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 18 Circuits, 0.38μm (15μ) Gold (Au) Plating
File Size 367.52K  /  6 Page

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Amphenol Communications Solutions
Part No. 10082627-404HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87832-1420

Molex Electronics Ltd.
Part No. 87832-1420
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 14 Circuits, 0.38μm (15μ) Gold (Au) Plating
File Size 367.54K  /  6 Page

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Amphenol Communications Solutions
Part No. 54122-108261000LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 26 Positions
Tech specs 　 　

Official Product Page

    87832-1421

Molex Electronics Ltd.
Part No. 87832-1421
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Lead free, 14 Circuits, 0.76μm (30μ) Gold (Au) Plating
File Size 386.31K  /  6 Page

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Amphenol Communications Solutions
Part No. 130-8262-15D
Description Paladin Plus 8-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs 　 　

Official Product Page

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