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  90136-1212 Datasheet PDF File

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    0901361103 90136-1103

Molex Electronics Ltd.
Part No. 0901361103 90136-1103
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Murata Manufacturing Co Ltd

Part No. MGN1S1212MC-R7
Description DC-DC 1W SM 12-12V GAN
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2306 0901362306

Molex Electronics Ltd.
Part No. 90136-2306 0901362306
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Rochester Electronics LLC

Part No. AM27C512-120DC
Description AM27C512 - 512K (64K x 8) CMOS EPROM
Tech specs    

Official Product Page

    90136-2302 0901362302

Molex Electronics Ltd.
Part No. 90136-2302 0901362302
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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Rochester Electronics LLC

Part No. AM27C512-120DE
Description AM27C512 - 512K (64K x 8) CMOS EPROM
Tech specs    

Official Product Page

    0901361105 90136-1105

Molex Electronics Ltd.
Part No. 0901361105 90136-1105
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.33K  /  4 Page

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Rochester Electronics LLC

Part No. AM27C512-120PI-G
Description AM27C512 - 512Kb (64K x 8-Bit) CMOS OTP EPROM
Tech specs    

Official Product Page

    0901361106 90136-1106

Molex Electronics Ltd.
Part No. 0901361106 90136-1106
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901361108 90136-1108

Molex Electronics Ltd.
Part No. 0901361108 90136-1108
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0901361107 90136-1107

Molex Electronics Ltd.
Part No. 0901361107 90136-1107
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-1125 0901361125

Molex Electronics Ltd.
Part No. 90136-1125 0901361125
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. G87MP121212P1HR
Description Mini power plus, Vertical, Dual row, 4.2mm pitch, 12 positions , 100u\\ Tin, 3.50mm tail length, 2 posts, LCP, Natural , TRAY
Tech specs    

Official Product Page

    90136-1207 0901361207

Molex Electronics Ltd.
http://
Part No. 90136-1207 0901361207
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 77317-812-12LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 12 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    90136-1204 0901361204

Molex Electronics Ltd.
Part No. 90136-1204 0901361204
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021212-00040T4LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Right Angled Header, Through Hole, Double Row, 40 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

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