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  alumin Datasheet PDF File

For alumin Found Datasheets File :: 54    Search Time::2.266ms    
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Part No. QID4515004
OCR Text ...ries chip t echnology ? alumin um nitride (aln) ceramic substr ate for low thermal impedance ? c omplementary line-up in expanding curr ent ranges to mitsubishi hvigbt p ower modules ? c opper baseplate ...
Description    Dual IGBT
File Size 574.44K  /  7 Page

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    List of Unclassifed Man...
Part No. SFM5300
OCR Text ...ed via o - ring sealing to the alumin i um body. the packagi ng allows the sfc 5300 / sfm 5300 mass flow controller / meter to operate under high input pressure conditions (up to 10 bar / 145 psi standard). the electrica...
Description    Ultra-fast settling time (down to 50 ms)
File Size 560.80K  /  10 Page

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    TT Electronics.
Part No. BDDSS8-A-01-1002-J-G WBDDQSC-A-01-1002-B-A WBDDQSC-A-01-1002-B-B WBDDQSC-A-01-1002-B-D WBDDQSC-A-01-1002-B-C WBDDQSC-A-01-1002-B-F WBDDQSC-A-01-1002-B-G
OCR Text ... 0.01) bond p ad metallization alumin um 10k? minim um gold 1 15k? minim um bac kside silicon (gold a v ailab le 1 ) p assiv ation silicon dio xide or silicon nitr ide r esis t or s all parts ar e pb- fr ee and c omply with eu 2011/65/...
Description Wire Bondable Resistor Network Arrays
File Size 476.57K  /  4 Page

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Part No. QID1210007
OCR Text ... features: lo w e sw(off) alumin um nitride isolation discrete super-fast recovery free-wheel silicon carbide schottky diode low internal inductance 2 individual switches per module isolat ed baseplate for easy hea...
Description Split Dual Si/SiC
File Size 518.90K  /  7 Page

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Part No. QID1215003
OCR Text ... features: lo w e sw(off) alumin um nitride isolation discrete super-fast recovery free-wheel silicon carbide schottky diode low internal inductance 2 individual switches per module isolat ed baseplate for easy hea...
Description Hybrid IGBT Module
File Size 519.80K  /  7 Page

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Part No. QID3310006
OCR Text ...ries chip t echnology ? alumin um nitride (aln) ceramic substr ate for low thermal impedance ? c omplementary line-up in expanding curr ent ranges to mitsubishi hvigbt p ower modules ? c opper baseplate ...
Description Dual IGBT HVIGBT Module 100 Amperes/3300 Volts
File Size 543.74K  /  6 Page

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Part No. QID3320004
OCR Text ...ries chip t echnology ? alumin um nitride (aln) ceramic substr ate for low thermal impedance ? c omplementary line-up in expanding curr ent ranges to mitsubishi hvigbt p ower modules ? c opper baseplate ...
Description Dual IGBT HVIGBT Module 200 Amperes/3300 Volts
File Size 543.39K  /  6 Page

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Part No. QID3350001
OCR Text ...logy ? alsic baseplat e ? alumin um nitride (aln) ceramic substr ate for low thermal impedance ? c omplementary line-up in expanding curr ent ranges to mitsubishi hvigbt p ower modules ? r ugged swsoa and ...
Description Dual IGBT HVIGBT Module 500 Amperes/3300 Volts
File Size 470.40K  /  6 Page

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Part No. QID4520002
OCR Text ...ries chip t echnology ? alumin um nitride (aln) ceramic substr ate for low thermal impedance ? c omplementary line-up in expanding curr ent ranges to mitsubishi hvigbt p ower modules ? c opper baseplate ...
Description Dual IGBT
File Size 481.96K  /  6 Page

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Part No. QID6508001
OCR Text ...ries chip t echnology ? alumin um nitride (aln) ceramic substr ate for low thermal impedance ? c omplementary line-up in expanding curr ent ranges to mitsubishi hvigbt p ower modules ? c opper baseplate ...
Description Dual IGBT HVIGBT Module 85 Amperes/6500 Volts
File Size 563.46K  /  7 Page

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For alumin Found Datasheets File :: 54    Search Time::2.266ms    
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