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  die-11 Datasheet PDF File

For die-11 Found Datasheets File :: 30044    Search Time::0.922ms    
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    ATMEL CORP
Part No. AT24C512-W2.7-11
OCR Text ...sap and 8-ball dbga2 packages  die sales: wafer form, waffle pack and bumped die description the at24c512 provides 524,288 bits of serial e...11). page write: the 512k eeprom is capable of 128-byte page writes. a page write is initiated t...
Description 10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE)

File Size 366.04K  /  20 Page

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    11-40-2083 T8300J 1140-2083 0011-40-2083 001140-2083

Molex Electronics Ltd.
Part No. 11-40-2083 T8300J 1140-2083 0011-40-2083 001140-2083
OCR Text ...ctive description: terminator die documents: rohs certificate of compliance (pdf) general product family application tooling series t1801 function crimp geographic area global level of automation semi-automatic more de...
Description Terminator Die

File Size 19.89K  /  1 Page

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    Atmel Corp.
Part No. AT24HC02B-W1.8-11
OCR Text ...oic and 8-lead tssop packages  die sales: wafer form, waffle pack, and bumped wafers description the at24hc02b provides 2048 bits of serial...11. figure 11. random read sequential read: sequential reads are initiated by either a current ad...
Description Utilizes Different Array Protection Compared

File Size 442.27K  /  16 Page

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    Atmel Corp.
Part No. AT24C128-W1.8-11 AT24C128-W2.7-11 AT24C128U2-10UU-1.8 AT24C128W-10SU-1.8 AT24C128N-10SU-2.7 AT24C128W-10SU-2.7 AT24C128N-10SU-1.8 AT24C128-10TI-2.7 AT24C128-10TI-1.8 AT24C128Y1-10YU-1.8 AT24C128-10TU-1.8 AT24C128-10TU-2.7 ATMELCORP-AT24C128-10PU-1.8
OCR Text ...p and 8-ball dbga2 packages  die sales: wafer form, waffle pack, and bumped wafers description the at24c128/256 provides 131,072/262,144 ...11). the device address word consists of a mandatory one, zero sequence for the first five most sign...
Description Two-wire Serial EEPROMs

File Size 381.33K  /  23 Page

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    Atmel Corp.
Part No. AT24C02B-W1.8-11 AT24C02B-10TU-1.8
OCR Text ...ages  lead-free/halogen-free  die sales: wafer form, waffle pack and bumped wafers description the at24c02b provides 204 8 b its of seri...11). page write: the 2k eeprom is c a p ab le of a n 8 - b yte p a ge write. a p a ge write is in...
Description Two-wire Serial EEPROM

File Size 402.99K  /  20 Page

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    Mitsubishi Electric Semicon...
Part No. RA30H3340M-11 RA30H3340M-101
OCR Text ...the mosfet transistor chips are die bonded onto metal, wire bonded to the substrate, and coated with resin. lines on the substrate (eventually inductors), chip capacitors, and resistors form the bias and matching circuits. wire leads solder...
Description RoHS Compliance , 330-400MHz 30W 12.5V, 3 Stage Amp. For MOBILE RADIO

File Size 200.28K  /  8 Page

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    MACOM[Tyco Electronics]
Part No. MAAMGM0003-DIE
OCR Text DIE Features 1.0 - 15.0 GHz GaAs MMIC Amplifier 1.0 to 15.0 GHz Operation 0.4 Watt Saturated Output Power Level Variable Gai...11 25 7.5 39 2:1 <8 < 480 mA mA Units GHz dBm % dBm dB dBm RO-P-DS-3046 - - 2/7 0.4W Variab...
Description 0.4W Variable Distributed Amplifier 1.0 - 15.0 GHz

File Size 265.55K  /  7 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0016-DIE
OCR Text DIE Rev A Preliminary Datasheet 12.0-15.0 GHz Operation 5 Watt Saturated Output Power Level Variable Drain Voltage (4-10V) Operation S...11.5 12.0 12.5 13.0 13.5 Frequency (GHz) 14.0 14.5 15.0 0 15.5 0 Figur...
Description 5W Ku-Band Power Amplifier 12.0-15.0 GHz

File Size 262.83K  /  5 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0018-DIE
OCR Text DIE Features 12.0-15.5 GHz GaAs MMIC Amplifier 12.0-15.5 GHz Operation 2 Watt Saturated Output Power Level Variable Drain Vol...11.4 C/W * VDD * IDQ Operating Instructions This device is static sensitive. Please handle with ...
Description 2W Ku-Band Power Amplifier 12.0-15.5 GHz

File Size 327.09K  /  6 Page

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