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NXP Semiconductors N.V.
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Part No. |
74HC1G02GW/T1 74HCT1G02GW/T1
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OCR Text |
...stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical re... |
Description |
SC70/µDFN, Single/Dual Low-Voltage, Low-Power µP Reset Circuits IC-SM-CMOS LOGIC 集成电路钐CMOS逻辑
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File Size |
63.21K /
12 Page |
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it Online |
Download Datasheet |
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Philips
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Part No. |
74HC7014
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OCR Text |
...stencilling or pressure-syringe dispensing before package placement.
74HC7014
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating met... |
Description |
Hex non-inverting precision
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File Size |
51.56K /
9 Page |
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it Online |
Download Datasheet |
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Bourns Inc.
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Part No. |
2QSP24 2DEA
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OCR Text |
...ted ESD Protection Diode Array
dispensing
For large quantities, the product will be dispensed in Tape and Reel (see diagram below).
A0
DIMENSIONS = MM (INCHES)
B0
K0
Package QSOP 24 Pin WBSOIC 20 Pin How To Order
A0 6.... |
Description |
Integrated ESD Protection Diode Array
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File Size |
258.83K /
3 Page |
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it Online |
Download Datasheet |
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Price and Availability
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