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Part No. |
AM29834DC AM29834DCB AM29854PC AM29834LCB
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Description |
900V Warp 20-100 kHz Copack IGBT in a TO-247AC package; Similar to IRG4PF50WD with Lead Free packaging 600V Fast 1-5 kHz Hard Switching Copack IGBT in a TO-220AB package>20kHz resonant mode; A IRG4BC30FD1 with Standard packaging 600V UltraFast 10-30 kHz IGBT in a TO-262 package; A IRGSL6B60K with Standard packaging 600V UltraFast 10-30 kHz Copack IGBT in a D2-Pak package; A IRG4BC15UD-S with Standard packaging
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File Size |
267.35K /
10 Page |
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HAMAMATSU[Hamamatsu Corporation] Hamamatsu Photonics K.K.
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Part No. |
G7881-21 G7881-22 G7881-23 G7881-32 G7881-44 G8339 G8339-21 G8339-22 G8339-23 G8339-32 G8339-44 G8796-44 G8342-21 G8342-22 G8342-23 G8342-32 G8342-44 G8796-21 G8796-22 G8796-23 G8796-32 G7881
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Description |
Supply voltage:0.3-5.5V; InGaAs PIN photodiode with preamp: receptacle type, 1.3/1.55um, 156, 622Mbps/1.25, 2.5Gbps. For optical fiber communications, fiber channel, gigabit enthernet, HDTV, SDH Aluminum Snap-In Capacitor; Capacitance: 100uF; Voltage: 400V; Case Size: 20x30 mm; packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 6800uF; Voltage: 25V; Case Size: 25x25 mm; packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 390uF; Voltage: 400V; Case Size: 35x30 mm; packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 150uF; Voltage: 400V; Case Size: 20x40 mm; packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 680uF; Voltage: 400V; Case Size: 35x45 mm; packaging: Bulk Aluminum Snap-In Capacitor; Capacitance: 100uF; Voltage: 400V; Case Size: 22x25 mm; packaging: Bulk 铟镓砷PIN光电二极管和前置放大 Aluminum Snap-In Capacitor; Capacitance: 390uF; Voltage: 400V; Case Size: 25x50 mm; packaging: Bulk 铟镓砷PIN光电二极管和前置放大 Aluminum Snap-In Capacitor; Capacitance: 470uF; Voltage: 250V; Case Size: 30x25 mm; packaging: Bulk 铟镓砷PIN光电二极管和前置放大 FIBER OPTIC RECEIVER, 1250Mbps, PANEL MOUNT, LC CONNECTOR Aluminum Snap-In Capacitor; Capacitance: 68uF; Voltage: 400V; Case Size: 20x25 mm; packaging: Bulk
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File Size |
117.03K /
2 Page |
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Analog Devices, Inc.
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Part No. |
AM29821DM AM29825DM AM29823DM AM29821DC AM29821A/B3A AM29821A/BKA AM29823A/B3A AM29825A/B3A AM29821A/BLA AM29825A/BKA AM29821ADC AM29823AJC AM29825PC
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Description |
10-Bit D-Type Flip-Flop 300V 1 Form A Photo Voltaic Relay in a mod. 8-pin DIP Package; A PVA3324N with Standard packaging Complete Sensorless Drive Design Platform iMOTION Development System; A IRMCS2031 with Standard packaging High-voltage DC-DC buck converter for HB-LEDs constant current control; A IRPLLED1 with Standard packaging 9-Bit D-Type Flip-Flop 20V 1 Form A Photo Voltaic Relay in a 6-pin DIP Package; A PVN012 with Standard packaging Halogen Convertor, 220/230VAC Input, 12VAC Output, 100VA Max; A IRPLHALO1E with Standard packaging 250V 1 Form A Photo Voltaic Relay in a 6-pin SMT Package; A PVT312LS with Tape and Reel packaging Digital dimming DALI (Digital Addressable Lighting Interface) compliant lighting linear ballast with 1% dimming, IR2159, U.S. version, 120VAC line, 32W/T8 lamp; A IRPLDIM2U with Standard packaging A 3-Way CFL Dimming Ballast; A IRPLCFL4 with Standard packaging 10位D型触发器 Octal D-Type Flip-Flop 八路D类触发器
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File Size |
640.22K /
16 Page |
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Molex Electronics Ltd.
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Part No. |
87914-1816
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray packaging, Lead-free
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File Size |
3,779.50K /
48 Page |
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ITT, Corp. Ironwood Electronics
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Part No. |
PSX96B-133MQ160 PSX160-80PQ240 PSX160-66PQ240 PSX160-66PQ240I PSX160-80PQ240I PSX96B-80PQ160 PSX96B-80PQ160I PSX128B-100MQ208 PSX160-100MQ240I PSX96B-66MQ160 PSX96B-100PQ160I PSX96B-66PQ160I PSX160-66PB256 PSX96B-80MQ160 PSX160-80PB256 PSX96B-100MQ160
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Description |
-55V Single P-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU9024NCPBF with Standard packaging -55V Single P-Channel HEXFET Power MOSFET in a TO-220 Full-Pak package; Similar to IRLIB9343 with Lead Free packaging User Programmable Special Function ASIC -150V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF6217 with Standard packaging -30V P-Channel HEXFET Power MOSFET in a LeadFree SO-8 -package; A IRF7416QPBF with Standard packaging -20V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7425 with Standard packaging -20V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7425 with Lead-Free packaging. -55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; A IRLR9343 with Standard packaging -55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR9024N with Lead Free packaging -55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR5505 with Lead Free packaging -55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR5305 with Lead Free packaging 用户可编程ASIC的特殊功 -20V Single P-Channel HEXFET Power MOSFET in a 4-Lead FlipFET package; A IRF6100 with Standard packaging 用户可编程ASIC的特殊功 -20V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7207 with Lead Free packaging 用户可编程ASIC的特殊功 -55V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF4905S with Standard packaging 用户可编程ASIC的特殊功
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File Size |
2,727.12K /
53 Page |
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Molex Electronics Ltd.
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Part No. |
0879143203 87914-3203
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray packaging,Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray packaging,Lead-free
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File Size |
759.86K /
11 Page |
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Price and Availability
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